Unlike the captive Intel model, Micron is targeting an open fabric model.

Next-gen 3D XPoint will narrow the performance gap with DRAM.

A Micron patent application reveals the ace up their sleeve.

It appears that very few accept the fact that 3D XPoint ("3DXP") possesses the characteristics necessary to displace even some amount of DRAM sales. Well, here's proof:

Source: StorageReview;

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