Process Control

A. Chip Bonding









B. Wire Bonding





C. Glue pouring







D. Roller-type stripping





E. LED sorting





F. Taping

G. Warehousing

Outgoing goods inspection









1. Before chip bonding, use automatic plating machine and plasma cleaning machine to ensure the consistency and surface cleaning of the bracket.2. Operators use high/low power microscopy to check and analyze the height, position and glue content of chip bonding.3. Operators use an automatic push-pull machine to test the adhesion of the solidified crystal and calculate the CPK value.4. Use thermometer to test the solidification temperature to ensure the consistency and uniformity of the temperature.1. Operators use plasma cleaning machine to clean the surface of support;2. Operators use high/low power microscope to check and analyze the arc, height, diameter and ball diameter of welding wire.3. Operators use an automatic push-pull machine to test the pull force of the gold wire after welding and the push force of the bonding of the gold ball.1. Operators use plasma cleaning machine to clean the surface of support;2. Engineers use high-precision electronic scales to weigh phosphor and silica gel and mix them.3. Operators use machine to test photoelectric parameters before baking and after glue poured to ensure the consistency of photoelectric parameters.4. Operators use a high/low power microscope to examine the appearance of goods after glue poured.1. Operators use high/low power microscopy to examine and analyze burrs and scratches after roller-type stripped step.2. Operators use thermometers to control oven temperature.3. Operators use pure water to prevent surface contamination.1. Operators use high/low power microscopes to detect sundries and bubbles after LED sorted.2. Operators use integral sphere and spectrophotometer to compare the test data and control the calibration.3. Operators use integral spheres to control the photoelectric parameters of the spectrometer.1. Operators use high/low power microscopy to check and analyze the air bubbles, debris, dislocation and leakage after braiding.2. Operators use integral spheres to sample photoelectric parameters to ensure the conformity of BIN files.3. Operators use high temperature and humidity testing machine, cold and hot shock testing machine and aging testing instrument to control the performance of products.1. Select a certain proportion of samples and test the appearance and photoelectric properties of the products to ensure that they meet the requirements of the standards.2. Check the number of packages, label specifications, product specifications and product codes;3. Use antistatic bags, desiccants, vacuum sealing machines to ensure the conformity of product packaging;1. Sampling test and control of photoelectric properties of products by integrating spheres;2. Sampling control of product appearance and other items according to high/low power microscope;3. Check the shipment inspection report, shipment specifications, shipment quantity, packaging specifications and other items again; Operators uses an automatic push-pull machine to test the adhesion of the solidified crystal and calculate the CPK value.