Exynos 9810

Our Galaxy S9+ model includes Samsung's own Application Processor Exynos 9810. The Application Processor module is a Package-on-Package (PoP) with Samsung's own 6GB LPDDR4X SDRAM K3UH6H60AM-AGCJ. We were hoping to see the rumored DDR5, but this version of the phone still includes the LPDDR4X.

The Exynos 9810 is fabbed in Samsung's 2nd generation 10nm FinFET process 10nm LPP. According to Samsung, the 10LPP process technology allows up to 10% higher performance or 15% lower power consumption compared to its first generation 10nm LPE (Low Power Early).

TechInsights has already analyzed the Samsung 10LPE process technology found inside the Qualcomm Snapdragon 835 and Samsung Exynos 8895 APs. We have published a few competitive technical analysis reports such as Digital Functional Analysis Report (DFAR), Advanced CMOS Essentials (ACE), and Transistor Characterization Report. We will also analyze the Samsung 10LPP process in a few report formats.

We have decapped the Samsung Exynos 9810 AP PoP and gotten the images of the AP/Modem die with a die mark S5E9810A02. The die size (seal) is 10.37 mm x 11.47 mm = 118.94 mm2, a slight bigger than the previous Exynos 8895 AP/Modem die S5E8895A01’s seal die size 10.50 mm x 9.87 mm = 103.64 mm2.