A cooling system is provided for a head mounted device for augmented reality applications. The head mounted device has a visor housing having one or more exhaust vents and one or more intake vents, a motherboard disposed within the visor housing, at least one processor mounted to the motherboard and at least one camera mounted to the motherboard. At least a pair of cooling subsystems disposed within the visor housing provide generally balanced horizontal weight to the...

Browse recent Sulon Technologies Inc. patents

#20170184863

TECHNICAL FIELD - Top of Page

The following relates generally to cooling of electronic circuitry and more particularly to cooling of a head mounted device having electronic circuitry therein.

BACKGROUND - Top of Page

Augmented reality (AR) and virtual reality (VR) visualisation applications are increasingly popular. The range of applications for AR and VR visualisation has increased with the advent of wearable technologies and 3-dimensional (3D) rendering techniques. AR and VR exist on a continuum of mixed reality visualisation.

Various wearable devices for AR and VR applications are implemented as head mounted devices (HMDs). Various existing HMDs do not have an excessive heat generation problem because they are implemented with relatively weak processors. This is commonly the case for HMDs which are conduits for viewing a smartphone display and utilizing built-in smartphone processors for generation of AR and VR environments and objects.

Conversely, increasing processing capabilities onboard various HMDs may correspond to elevated heat generation by onboard systems. Device performance, as well as user comfort or safety may suffer from elevated device temperatures.

SUMMARY - Top of Page

In one aspect, a head mounted device for augmented reality applications is provided, the head mounted device comprising at least one cooling subsystem comprising a fan.

In another aspect, a head mounted device for augmented reality applications is provided, the head mounted device comprising: a visor housing having two or more exhaust vents and one or more intake vents; a motherboard disposed within the visor housing; at least one processor mounted to the motherboard; at least one camera mounted to the visor housing; and at least a pair of cooling subsystems disposed within the visor housing to dissipate heat generated by the at least one processor from the exhaust vents and receive air flow from the intake vents, the cooling subsystems arranged to provide generally balanced horizontal weight to the visor housing.

In yet another aspect, a cooling system is provided for an augmented or virtual reality (AR/VR) head mounted device (HMD). The HMD comprises a visor housing having a display viewable by a user wearing the HMD and electronics for driving the display. The cooling system is disposed predominantly on an opposing side of the display from the user so as to not obstruct viewing of the display by the user. The cooling system comprises: a plurality of fans directing airflow outward from the HMD to an environment surrounding the HMD, and at least two of the plurality of fans are disposed along opposing sides of a vertical midpoint of the HMD.

In a further aspect, an AR or VR HMD is provided. The HMD comprises: a visor housing having a display viewable by a user wearing the HMD electronics for driving the display, and a cooling system disposed predominantly on an opposing side of the display from the user so as to not obstruct viewing of the display by the user. The cooling system comprises: a plurality of fans directing airflow outward from the HMD to an environment surrounding the HMD. At least two of the plurality of fans being disposed along opposing sides of a vertical midpoint of the HMD.

In a still further aspect, a cooling system is provided for an AR or VR HMD. The HMD comprises a visor housing having a display viewable by a user wearing the HMD and electronics for driving the display. The cooling system is disposed predominantly on an opposing side of the display from the user so as to not obstruct viewing of the display by the user, and the cooling system comprises at least one fan directing airflow upward from the HMD.

These and other aspects are contemplated and described herein. It will be appreciated that the foregoing summary sets out representative aspects of systems and methods, to assist skilled readers in understanding the following detailed description.

DESCRIPTION OF THE DRAWINGS

A greater understanding of the embodiments will be had with reference to the Figures, in which:

FIG. 1 is a top perspective view of an HMD for AR applications;

FIG. 2 is a front view of a motherboard for an HMD illustrating a first embodiment of a cooling system with fans mounted parallel to the motherboard;

FIG. 3 is a bottom perspective view of the motherboard;

FIG. 4 is a rear view of components that are mounted to the motherboard;

FIG. 5 is a rear view of the motherboard;

FIG. 6 is a side cross-sectional view of the motherboard and a display of the HMD taken along the line 6-6 in FIG. 4;

FIG. 7 is a side view of the HMD;

FIG. 8 is a bottom perspective view of the HMD;

FIG. 9 is an air flow diagram showing an embodiment of the cooling system in use;

FIG. 10 is a top perspective view of a second embodiment of the cooling system and motherboard with the fans of the cooling system disposed transversely to the motherboard;

FIG. 11 is an exploded perspective view of the second embodiment illustrating a vent configuration of the visor housing;

FIG. 12 is an isolated view of heat pipes and a heat sink of the second embodiment;

FIG. 13 is an exemplary HMD configured for use with the second embodiment;

FIG. 14 is a heat map from an exemplary thermal simulation conducted using the second embodiment;

FIG. 15 is a front perspective view of a third embodiment of the cooling system with fans mounted parallel to the motherboard and along an outer surface of the motherboard;

FIG. 16A is a front perspective view of an exemplary HMD with a top panel shown removed, configured for use with of a fourth embodiment of the cooling system with in which fans are mounted transversely to the motherboard and having fan inlets are directed to the environment;

FIG. 16B is a front perspective view of the exemplary HMD of FIG. 16A with the top panel shown in place;

FIG. 17 illustrates an embodiment of the cooling system incorporating a rounded heat pipe having a plurality of transverse heat fins disposed around a radial fan;

FIG. 18 illustrates a panel of the HMD\'s visor housing having perforations disposed therethrough;

FIG. 19A is a front perspective view in schematic form of a configuration of the motherboard and cooling system for an HMD;