Let's first take a look at the different configurations of the Skylake die. Alike in the past, Intel distinguishes the processors according to the number of CPU cores, the level of the graphics unit and the presence of an eDRAM cache. Differences to Haswell can already be seen here: First of all, it is the first time that 64 MB eDRAM is also available in (U)LV chips of the 15 and 28 Watt classes. At least this is true for models with GT3 GPU (48 EUs). As a result, the marginal performance gain compared to GT2 models (24 EUs) should increase drastically - and could make ultrabooks without dedicated graphics cards offer acceptable gaming capabilities.

The so-called "4+4e" configuration, i.e. a quad-core die with GT4 graphics (72 EUs) and 128 MB eDRAM stands out. Thanks to it, the new top model delivers at least 50% more GPU performance than Haswell (GT3e: 40 EUs) and Broadwell (GT3e: 48 EUs). In addition, the architecture was improved and supports fast DDR4 memory. Unfortunately, such models will only be available in the coming months or in 2016.

Most of the coming Skylake notebooks might still incorporate two or four CPU cores and a GT2 graphics unit without eDRAM. Celeron and Pentium chips for the low-end segment are apparently simply partly deactivated. According to the current state of knowledge, there is no separate mask for models with GT1 graphics unit (probably 12 EUs).

We will introduce the new models of each TDP class in more detail now: