Embedding an Interconnect Bridge

We sought a solution that is practical to design, reliable across any die, and simple to implement in a design. The result is the Embedded Multi-die Interconnect Bridge, affectionately abbreviated to EMIB. There can be many embedded bridges in a single substrate, providing extremely high I/O and well controlled electrical interconnect paths between multiple die, as needed. Because the chips do not have to be connected to the package through a silicon interposer with TSVs, there is nothing to potentially degrade their performance. We use micro-bumps for high density signals, and coarser pitch, standard flip chip bumps for direct power and ground connections from chip to package.

The cross-section shows two die that have been assembled to a package with micro-bumps providing die-to-die connections through a bridge chip.