High Density Interconnect (HDI PCBs) are a part of most miniaturized electronics available today. With higher wiring density and finer lines and spaces, HDI PCBs are the way of the future. Do you know everything about HDI PCBs? Take our quiz to find out!

Results Well done! Although you seem to already be a master in HDI designing, you can still download our HDI PCB Design Guide to learn more! It looks like HDI PCB designing is not your strong suit. But it’s never too late to learn: maybe you can download our HDI PCB Design Guide next #1. What does HDI stand for? High Density Impedance High Density Interconnect High Density Interference next #2. What is one of the specificities of HDI PCBs? HDI PCBs have a higher wiring density per unit area. HDI PCBs can only have microvias. HDI PCBs never cause warpage. next #3. In a HDI PCB, microvias connect the layer with: Solder mask Copper plating Copper foil next #4. What is not true about the dielectric constant? As frequency increases, the dielectric constant usually decreases. The dielectric constant symbol is Dk. The dielectric constant of a material is not important for signal integrity. next #5. What does Tg stand for? Glass transition temperature Decomposition temperature Dielectric loss tangent next #6. What does the dielectric loss tangent measure? The temperature range in which a PCB substrate transitions. The power lost due to the material. The insulation resistance of a PCB material. next #7. What doesn’t the via-in-pad process do? It allows for the via to be placed within the surface of the flat lands. It reduces the drill cycle. It fills the via with either conductive or non-conductive epoxy. next #8. Why is the aspect ratio important? To make sure vias can be plated properly. To have a better control over the dielectric loss tangent. To determine the glass transition temperature. next #9. What do you call the layer of coating between the components and the bare HDI PCBs? The surface finish The copper layer The solder mask next #10. What method is used to drill holes on HDI PCBs? Laser drilling Mechanical drilling Both next #11. Why do manufacturers use sequential lamination? To drill the buried vias and the blind vias all at once and go through the lamination process only once. To allow prepreg to melt out the sides in order to get the PCB to a predetermined thickness. To limit the material, traces, and pads from shifting too much and causing annular breakouts when drilling vias. next #12. What is not true about controlled impedance? You can control impedance through the space between the signal trace and the signal return path. You can control impedance through the annular ring that surrounds a via. You can control impedance through the relative dielectric coefficient of a material. next #13. Which one is a step of the 0-N-0 with laser microvias HDI stackup? The core is mechanically drilled. The sequential lamination adds additional layers. The mechanical drill becomes a buried via. finish

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