The FinFET technology market is expected to grow from USD 4.91 Billion in 2015 to USD 35.12 Billion by 2022, at a CAGR of 26.2% between 2016 and 2022. Although the market is currently dominated with laptops and tablets end user segment, the smartphones and wearables segments are expected to gain traction and grow at the highest rate during the forecast period. This report forecasts the market size and future growth potential of market across different segments such as technology, product, end user, and region. The base year considered for the study is 2015, and the market size forecast is provided for the period between 2016 and 2022.

The research methodology used to estimate and forecast the FinFET technology market begins with capturing data on key vendor revenues through the secondary research. Vendor offerings are also taken into consideration to determine the market segmentation. The bottom-up procedure was employed to arrive at the overall size of the global market from the revenue of key players. After arriving at the overall market size, the total market was split into several segments and subsegments, which were then verified through primary research by conducting extensive interviews with key people such as CEOs, VPs, directors, and executives. Data triangulation and market breakdown procedures were employed to complete the overall market engineering process and arrive at the exact statistics for all segments and subsegments. The breakdown of profiles of primary interviews is depicted in the below figure:

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The key players in the market include Intel (U.S.), TSMC, Ltd. (Taiwan), Samsung (South Korea), and GlobalFoundries (U.S.), among others. These players have adopted various strategies such as partnerships, agreements, contracts, mergers & acquisitions, and new product developments to achieve growth in the global FinFET technology market.

Key Target audience

Wafer Manufacturers

Raw Material and Manufacturing Equipment Suppliers

Chip Manufacturers

System Integrators

Device Manufacturers

Foundry Players

Distributors and Retailers

Research Organizations

Technology Standard Organizations, Forums, Alliances, and Associations

Technology Investors

Scope of the Report

The research report segments the FinFET technology market to following subsegments:

By Technology:

22nm

20nm

16nm

14nm

10nm

7nm

By Product:

CPU

SoC

FPGA

GPU

MCU

Network Processor

By End User:

Smartphones

Computers and Tablets

Wearables

High-End Networks

Automotive

By Region:

North America

Europe

Asia-Pacific

Rest of the World

Available Customizations

With the given market data, MarketsandMarkets offers customizations as per the company�s specific needs. The following customization options are available for the report:

Geographic Analysis

Further breakdown of the North America FinFET technology market

Further breakdown of the Europe FinFET technology market

Further breakdown of the APAC FinFET technology market

Further breakdown of the RoW FinFET technology market

Company Information

Detailed analysis and profiling of additional market players

According to MarketsandMarkets forecast, the FinFET technology market is expected to grow from USD 4.91 Billion in 2015 to USD 35.12 Billion by 2022, at a CAGR of 26.2% between 2016 and 2022. The miniaturization of semiconductor devices to continue the progression of Moore�s law, along with an increase in the performance of devices, is creating a huge demand for the adoption of FinFET technology across the world. Moreover, growing smartphones and consumer electronics market, and high performance with a lower current leakage than the bulk technology are also driving the growth of the market.

The scope of this report covers the FinFET technology market segmented on the basis of technology, product, end user, and region. On basis of technology, the 22nm process node segment is expected to hold the largest market share of the global market, and the 7nm FinFET process is expected be the fastest-growing technology to manufacture chips in various applications during the forecast period.

On the basis of products, the FinFET technology market is segmented into CPU, SoC, FPGA, GPU, MCU, and network processor. CPU segment led the market in 2015; however, the market for GPUs is expected to grow at the highest CAGR during the forecast period. Application processors in smartphones have the same functionalities as that of CPUs. Samsung (South Korea) led the market for application processors in 2015 by introducing its Exynos Octa 7 chips manufactured using the 14nm FinFET technology. In 2016, the next chip in the Exynos series (Exynos Octa 8) is expected to power the smartphones with more functionalities and improved performance.

North America held the largest share of the FinFET market in 2015. Certain end use segment such as wearable technologies and smartphones in this region have shown a positive outlook for the growth of the FinFET technology market. This is a result of the necessity to adhere to the stringent corporate compliance and regulation requirements for these sectors, in which applications of FinFET technology account for a major share of the North American market.

The market in APAC region is estimated to grow rapidly between 2016 and 2022. The growth in the demand for high-end smartphones in this region has driven the FinFET technology market. Samsung (South Korea) is the first company to manufacture chips using the technology at 14nm process. Exynos Octa 7 is manufactured using the 14nm process which is used in Samsung Galaxy S6 and S6 edge phones. Also, the presence of two key players � TSMC, Ltd. (Taiwan) and Samsung (South Korea) is responsible for the popularity of FinFET technology in this region. TSMC (Taiwan) and Samsung (South Korea) manufactured the A9 processor for Apple (U.S.) using FinFET technology.

The complexities in the FinFET design process restrain the growth of FinFET technology market. The major challenge for the adoption of FinFET technology is low costs of wafers and gate cost of FD-SOIs. The cost of processed wafer and gate in SOIs is lesser compared to bulk CMOS and FinFETs, and the considerations include processing and mask steps, tool depreciation, die shrink area, and parametric yield. The low cost of FDSOI is a one of the major challenges for the market as there is not much difference between the performance of these two technologies; the former provides equal or better power consumption at a lower cost.

Major players in this market are Intel (U.S.), Samsung (South Korea), GlobalFoundries (U.S.), and TSMC (Taiwan). These players have adopted various strategies such as partnerships, agreements, mergers & acquisitions, and new product developments to achieve growth in the global FinFET technology market.

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