Sapphire & Substrate Dicing, High Volume Production Dicing Services

From R&D and prototype precision dicing to full production lapping and polishing, Valley Design can do it all. For over 35 years, Valley has been providing dicing of micro precision wafers and substrates for a wide range of high technology applications.

Utilizing programmable DISCO and K&S saws, parts can be diced to micron level tolerances with 200X optical magnification. Valley has recently expanded its dicing department, and now offers one of the largest production dicing capacities in the industry. Parts can be diced as small as 0.127mm square. Valley dices both customer supplied wafers and parts, as well as dices parts from our extensive material inventory. Materials diced include Fused Silica, Aluminum Nitride, 96% - 99.8% Alumina, Glass of all types, Silicon, Sapphire, Silicon Carbide, Macor ceramics, Ferrites, Germanium, Polyimides and PEEK, metals and more.

High volume dicing features and applications include:

Chip-free edges

Beveling

Scribing

Trenching

Die edge polishing

Wide or narrow streets from as thin as 25um up to 1.25mm

Thin die dicing

Die edge trimming

Double cuts

Stepped cuts

Thick wafer dicing

Plunge cuts

Coated and patterned wafer dicing

Metallized substrates and wafers

Nitto and UV tape dicing

Wax bonded dicing

Top side wafer protection

Shims, spacers and submounts which can be sequentially spaced within microns

In addition to dicing services, Valley offers a true one-stop shop including CNC 4 axis micromachining, Lapping and Polishing services, Ultrasonic Hole Drilling, backgrinding and other precision machining services for custom and standard parts from as small as 0.127mm square to 450mm diameter wafers. Valley has even processed parts as large as 72” long.

For more technical details on our prototype and production dicing capabilities please go to www.customdicing.com.





