OSD335x System-in-Package

A New Era of Integration and Flexibility based on AM335x

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Faster and Smaller Designs, Simplified Supply Chain, Low Cost Manufacturing

The Octavo Systems OSD335x System-in-Package (SiP) device is the first device in the OSD335x Family. It integrates the Texas Instruments Sitara ARM® Cortex®-A8 AM335x Processor, DDR3 memory, TPS65217C PMIC, TL5209 LDO, and all needed passive components into a single 27mm X 27mm BGA package.

Integrating the DDR3, power system, and passive devices into the single package removes the complexities of DDR3 to processor interfacing and power sequencing. This allows for a vastly simplified final system design.

The 400 Ball BGA package is 40% smaller than the equivalent discrete design making it a great solution for space constrained applications. The package also utilizes a 1.27mm (50 mil) ball pitch making it extremely easy to assemble. The ball pitch also allows for the use of more relaxed Printed Circuit Board (PCB) design rules, saving PCB cost.

The OSD335x provides a quick and easy way to implement a system around the TI AM335x while also providing space savings, simplified supply chains, lower cost manufacturing, and greater reliability.

Additional Variants:

OSD335x-SM – Same functionality in a smaller package and adds EEPROM.

OSD335x C-SiP – Same functionality but adds eMMC Flash, MEMs Oscillator, and EEPROM.