SK Hynix today announced it has developed the world's first 128GB DDR4 memory module, twice the capacity of the company's current 64GB module.

The new memory module, which is also being touted as the world's highest density module, is based on 8Gbit DDR4 chips created with 20nm process lithography.

Hynix's 128GB DDR4 module.

The new memory module runs at 2,133Mbps with 64-bit I/O, and processes up to 17GB of data per second. It also runs at ultra low-voltage of 1.2V, compared to 1.35V of existing DDR3 memory modules.

While major memory makers such as Hynix, Samsung and Crucial have started producing next-generation DDR4 memory, it's not expected to show up in servers until late this year, and in PCs until 2015.

Until Intel and Advanced Micro Devices begin supporting DDR4 in their processor boards, users won't be able to enjoy the benefits of the technology, which offer twice the performance, twice the base capacity and 20% to 40% less power consumption than today's technology, according to industry analysts.

Intel is expected to add support for DDR4 memory to its high-end computers in the third quarter.

Hynix said it plans to begin shipping 128GB and 64GB DDR4 modules to computer makers soon.

Hynix's 128GB memory, which is expected to go into mass production early next year, is double the density of existing 64GB modules and uses TSV (Through Silicon Via) technology. TSV is a method for passing electrical connections vertically through a silicon die and is used to create three-dimensionally stacked integrated circuits.

Mike Howard, a DRAM and compute platforms analyst with research firm IHS, said Hynix's 128GB module is going to be a niche product. He said it is the 8GB, 16GB and 32GB DDR4 memory boards that are the mainstream densities right now.

"We expect Intel to support DDR4 for servers this year and client PC next year. DDR4/DDR3 crossover should occur sometime in mid 2016," Howard said. "I think this product is largely about bragging rights."

According to market research firm Gartner, the server DRAM market will grow an annual average of 37% until 2018, following expansion of the mobile environment. The new interface DDR4 is expected to be certified by customers this year and is anticipated to be commercialized regularly starting in 2015. The DDR4 is also expected to be the main standard in the industry from 2016.

"The development of the world's first 128GB DDR4 module has its significance in opening the ultrahigh density server market," Sung Joo Hong, head of DRAM Development at Hynix, said in a statement. "The company will further strengthen its competitiveness in the premium DRAM sphere with the development of high density, ultrahigh speed and low power consuming products."

This article, Hynix reveals world's first 128GB DDR4 memory module, was originally published at Computerworld.com.

Lucas Mearian covers consumer data storage, consumerization of IT, mobile device management, renewable energy, telematics/car tech and entertainment tech for Computerworld. Follow Lucas on Twitter at @lucasmearian or subscribe to Lucas's RSS feed . His e-mail address is lmearian@computerworld.com.

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