Last week, Qualcomm announced two new members of the Snapdragon 200 tier. As a reminder, Qualcomm has moved to a tiered structure split between 200, 400, 600, and 800 level parts, with higher numbers connoting higher-end parts. I waited a while before posting about these two new Snapdragon 200 family SoCs to verify some specific details on what's inside. These new parts are MSM8x10 and MSM8x12, both aimed at entry level phones for China and emerging regions.

MSM8x12 is the higher end of the two, and has four ARM Cortex A7s at 1.2 GHz inside alongside Adreno 302 graphics. MSM8x10 is dual core ARM Cortex A7 at 1.2 GHz also alongside Adreno 302. Both include support for single channel LPDDR2 at 333MHz. Both also include up to HSPA+ 21.1 on the downlink with the usual multimode flavors (HSPA+, TD-SCDMA, EVDO), the only difference on the modem side is that MSM8x12 includes support for both dual sim dual standby and dual sim dual active (DSDS, DSDA) while MSM8x10 only includes dual sim dual standby (DSDS). Both of these are 28nm SoCs and will be available with Qualcomm's reference design (QRD) platform late 2013.

Source: Qualcomm