AnandTech Podcast #36: The annual smartphone extravaganza known as Mobile World Congress has come and gone. We clocked up 45.4km on foot during the week, averaging around five hours sleep and one meal a day to be able to see everyone of interest. Because so many interesting things were presented, from LG, Samsung, Huawei, Xiaomi and others, just before we left Barcelona Andrei and I put together a podcast of details, experience and analysis of the new devices. There are plenty of talking points with each of them, from a modular design to heatpipes to new silicon microarchitectures, and we recorded our initial impressions in a podcast.

The AnandTech Podcast - Episode 36

Featuring

Dr Ian Cutress, Host, Senior Editor (@IanCutress)

Andrei Frumuşanu, Mobile Editor (@andreif7)

iTunes

RSS - mp3, m4a

Direct Links - mp3, m4a

Total Time: 1 hour 04 minutes 34 seconds

Outline mm:ss

00:00 – Intro

00:38 – LG G5

08:04 – Samsung Galaxy S7/S7 Edge

15:35 – Some thoughts about heatpipes on smartphones

17:27 – Details on 8890, thoughts on turbo mode on SoCs

22:40 – Waterproofing on S7/S7e

26:13 – Camera on S7/S7e

28:43 – Xiaomi Mi 5

42:32 – There’s a low bin of the Snapdragon 820

44:25 – HTC Vive Pricing

48:21 – Cat S60

52:23 – LG VR

58:49 – Huawei Matebook

1:04:24 – FIN