Yesterday a Bloomberg report stated that the upcoming Samsung Galaxy S6 would be skipping Qualcomm's Snapdragon 810 due to the chip overheating. The report said that the heat issues would force Samsung to go with its own Exynos chip worldwide, a big departure from the way previous Samsung products have worked. We already knew the Snapdragon 810 will be in Xiaomi's Mi Note Pro and LG's Flex 2, and after Samsung's reported Qualcomm diss, LG has stepped up to defend the semiconductor company's honor.

Speaking to Reuters , Woo Ram-chan, LG's Vice President for Mobile Product Planning said, "I am very much aware of the various concerns in the market about the [Snapdragon] 810, but the chip's performance is quite satisfactory... I don't understand why there is a [sic] issue over heat."

Of course, Samsung can be a lot pickier than LG when it comes to SoCs. LG has only dabbled in SoC production, but Samsung has far more advanced capabilities and uses its own SoCs in many territories. LG is essentially stuck with whatever Qualcomm puts out, unless it wants to switch to unpopular options from Nvidia and Intel.

We're inclined to believe reports of Snapdragon 810 heating issues. It's not the first time we've heard of the chip having heat issues, and some reports out of CES said the 810-powered G Flex 2 showed thermal throttling in the (non-final) demo units. Of course, in the mobile world, there is really no such thing as a chip that's "too hot," just a chip that gets throttled faster than usual. Everything butts up against its thermal limitations after a few minutes, a hotter chip just gets there faster. When we finally do get a Snapdragon 810 device in for testing, we'll be sure to see if there are any thermal issues.