Design For Assembly is an essential part of the PCB design and manufacturing process. Yet, many PCB designers still make mistakes that cause delays and sometimes extra costs. Do you know everything about DFA? Take our quiz and find out!

Results Congratulations! It seems like DFA doesn't have any secrets for you. How about you give us your feedback on our DFM Handbook It looks like you still have one or two things to learn about DFA. Don't worry, we have exactly what you need: download our DFM Handbook now! next #1. What is the leading show-stopper in assembly? Tagging the positive side with a plus symbol. Missing indicators on the silkscreen. Not interfering silkscreens with pads. next #2. Via-in-pads must be filled, unless… They reside in thermal pads. They reside in a BGA. They ensure a secure solder joint. next #3. What happens if one pad is substantially larger than its mate for a component? Component tombstoning can result from an imbalance of solder deposition. The connection to the component will be easier. The components will be properly aligned during assembly. next #4. What do you have to do if any component requires lead-free assembly? Only use a lead-free BGA, and components not specified for a lead-free assembly. Modify the design to use conventional leaded solder. Assemble the entire board lead-free. next #5. What should you always instruct the fabricator? Where the QFNs will sit. Where the BGA will sit. Where the connectors will sit. next #6. How can you achieve the best possible thermal distribution during solder reflow? By incorporating vias in the thermal pads under QFNs to help solder flow. By distributing large components across the board as evenly as possible. By connecting every component on its own independent pad. next #7. Where can you format the manufacturer’s name, the item number, and the reference designators? In the Impedance Calculator. In the HDI Stackup Planner. In the Bill Of Materials. next #8. If you need to assemble four boards, what must you not do? Repeat the reference designators from one board to another. List all of the components in a single BOM for all four boards combined. Guide placement by a single set of X-Y data for the entire panel. next #9. What does a design in ODB++ capture? All the issues that might impede assembly. The data for fabrication, assembly, and test in a unified structure. The signal integrity and the controlled impedance. finish