The Galaxy S7 was Samsung’s first phone to feature a heat pipe and word from the grapevine is that the company will use a similar design for the upcoming Galaxy S8. Allegedly, Samsung considered moving to a two-pipe design, but ultimately decided to stick with the tried and tested setup.

Back when the S7 launched, its heat pipe was the thinnest on the market - Samsung worked with its partners to make a pipe just 0.4mm thick. The pipe is responsible for taking heat from the chipset and bringing it to a graphite sheet on the back where it can be dispersed.



The heat pipe design of the Samsung Galaxy S7

Heat pipes are often found in high-end computer coolers (both desktop and laptop) and have gained popularity in phones recently. Apparently, LG is considering a similar pipe for the LG G6. Anyway, Samsung is expecting shipment of the Galaxy S8 pipes to start in February.

Source | Via