











Introduction



PCB Design Flow for High-Speed Designs



When Do You Call It a Complex Board?



Performance Characteristics



Signal Integrity for PCB Designers



What is Signal Integrity?



Need for Signal Integrity



Problems Encountered with High-Frequency Signals



What Leads to Signal Integrity Issues in a PCB?



Advantages of Differential Signaling



Common Mode Noise Tolerance



Controlled Impedance



What is Controlled Impedance?



How to Control the Impedance?



Errors to Avoid When Designing for Controlled Impedance



Controlled Impedance Design Checklist



How to Design a Board with Controlled Impedance?



Common Mistakes to Avoid in a Stack-Up for Controlled

Impedance



How Sierra Circuits deals with Controlled Impedance



Failure Analysis



Sierra Circuits Impedance Calculator



PCB Transmission Line



What is a PCB Transmission Line?



When is an Interconnection to Be Treated as a Transmission

Line?







Power Integrity



What is Noise?



What is Power Integrity?



What is Power Distribution Network (PDN)?



Managing Power Integrity



What is Target Impedance?



What are Decoupling Capacitors?



The Difference Between Signal Integrity and Power Integrity



Comparing Signal Integrity and Power Integrity



How to Measure Power Integrity?



The Function of Power Integrity Tools



EMI and Electromagnetic Compatibility (EMC)



Electromagnetic Compatibility (EMC)



What is EMC or EMI?



Sources of EMI



Best PCB Design Practices for EMC



Electrical Considerations for High-Speed and HDI



Component Placement Strategy



Floorplanning



Component Placement Considerations in High-Speed PCB



Termination Resistors



Orientation



Organization



Separating Analog and Digital Circuits



Ground Plane Isolation



High-Speed Routing Strategy



Best Routing Practices for High-Speed Routing



High-Speed Routing Tricks Tips



Stack-Up Design



Construct of a Stack-Up



Design of Stack-Up



Best Way to Do a Stack-Up for High-Speed Signals



Lamination Selection



Stack-Up Design Material Parameter Considerations



Planning High-Speed PCB Stack-Up



Selecting High-Speed Materials



PCB Material Categories



Signal Loss and Operating Frequency



Non-PTFE Materials



Stack-Up Guidelines for Mixed Materials



Hybrid Stack-Up Guidelines



Footprint for High-Speed Boards



Component Footprint Shapes



Pad Shapes for High-Speed PCB Design



Via Shapes Considerations



Component Selection and Placement



Vias



Blind and Buried Microvias



Microvias



Design tips for Traces, Vias, and Other PCB Components



Appendix



High-Speed PCB Design Checklist



Sierra Circuits Deliverables



Sierra Circuits PCB Design Capabilities



