[138 Pages Report] The market size of thermal interface materials (TIMs) is projected to be USD 2.33 Billion by 2021, registering a CAGR of 11.2% between 2016 and 2021. In this study, 2015 has been considered as the base year for estimating market size of thermal interface materials.

Objectives of the study:

To define and segment the global thermal interface materials market by type, application, and region

To identify and analyze the key growth drivers, restraints, and opportunities, influencing the TIMs market

To estimate and forecast the market for TIMs, in terms of value To analyze the recent market developments and competitive strategies, such as expansion, product launch/development, partnership, and merger & acquisition to draw the competitive landscape of the TIMs market

To strategically identify and profile the key market players and analyze their core competencies in each type and application of TIMs market

This research study used extensive secondary sources, directories, and databases, such as Hoovers, Bloomberg BusinessWeek, and Factiva to identify and collect information useful for this technical, market-oriented, and commercial study of the TIMs market. The primary sources are mainly several industry experts from core and related industries and preferred suppliers, manufacturers, distributors, service providers, and organizations related to all segments of the industry�s supply chain. The bottom-up approach has been used to estimate market size of TIMs by type, application, and region, in terms of value and volume. The top-down approach has been implemented to validate the market size, in terms of value and volume. With the data triangulation procedure and validation of data through primaries, the exact values of the overall parent market size and individual market sizes have been determined and confirmed in this study.

To know about the assumptions considered for the study, download the pdf brochure

Raw material suppliers in the thermal interface materials market are chemical companies providing raw materials to TIMs manufacturers. Henkel Corporation (U.S.), Bergquist Company (U.S.), Indium Corporation (U.S.), Parker Chomerics (U.S.), Dow Corning (U.S.), Laird Technologies (U.S.), Momentive Performance Materials Inc. (U.S.), and Zalman Tech Co., Ltd. (South Korea) some of the manufacturers of TIMs. The manufacturing companies process these raw materials to prepare different types of TIMs materials suitable for various end-use industries incorporating new technologies.

Target Audience:

Thermal interface materials manufacturers

TIMs traders

Distributors and suppliers

End-use market participants of different segments of TIMs

Government and research organizations

Associations and industrial bodies

Research and consulting firms

R&D institutions

Environment support agencies

Investment banks and private equity firms

�This study answers several questions for the stakeholders, primarily which market segments need to be focused in next two to five years for prioritizing the efforts and investments.�

Scope of the Report:

This research report categorizes the market for TIMs based on type, application, and region, and forecasts revenue growth and analysis of trends in each of the submarkets.

Based on Type:

The TIMs market is segmented on the basis of Type Into:

Greases & Adhesives

Tapes & Films

Gap Fillers

Metal-based thermal interface materials

Phase Change Materials

Others

Based on Application:

The thermal interface materials market is segmented on the basis of Application Into:

Computers

Telecom

Medical Devices

Industrial Machinery

Consumer Durables

Automotive Electronics

Others

Based on Region:

The TIMs market is segmented by Region Into:

Asia-Pacific China India Japan South Korea Indonesia Rest of Asia-Pacific

Europe Western Europe Germany U.K. France others Eastern & Central Europe Russia Turkey Poland Others

North America U.S. Canada Mexico

South America Brazil Rest of South America

Middle East & Africa UAE Saudi Arabia



Available Customizations:

The following customization options are available in the report:

Company Information

Analysis and profiling of additional global as well as regional market players (Up to three)

The market size of thermal interface materials, in terms of value, is projected to reach USD 2.33 Billion by 2021, at a CAGR of 11.2% between 2016 and 2021. The high demand from the electronics industry, increasing miniaturization of electronic devices, and continuous new product launches and expansion activities undertaken by different companies are the key factors driving the global market.

Phase change materials are projected to be the fastest-growing type segment during the forecast period. They are solid at room temperature and melt (undergo a phase change) as the temperature rises. This makes the material as easy to handle. These materials are effective conductors of heat, both above and below the melt point. When operating above the melt point, they are not effective as an adhesive and need mechanical support. Therefore, they are always used with a clamp, applying pressure in the 300 kPa range.

Phase change materials can be obtained in a variety of configurations, both supported and unsupported, and loaded with fillers to enhance thermal conductivity. These materials flow into voids between mating surfaces as effectively as thermal grease, when subjected to heat during the assembly process. These materials consist of organic binders (a polymer and a low melt-point crystalline component), thermally conductive ceramic fillers, and a supporting substrate (aluminum foil or woven glass mesh).

Medical device is the fastest-growing end-use application segment of the thermal interface materials market. The electronic devices used in the medical industry need proper thermal management. The electronics used in this sector must stay cool enough to run continuously and correctly within their operating temperature range. The effective thermal management allows excess heat to be efficiently moved, spread, and dissipated. This improves system reliability and service life of electronic devices in the medical industry. Many medical tools leverage the computing power of advanced microprocessors. These include lasers, ultrasound equipment, X-ray machines, and digital imaging technologies. These devices need effective thermal management as the excess heat can result in inaccuracies or malfunctions. TIMs play an important role in the development of cutting-edge devices used in imaging, diagnostic, and surgical applications.

Asia-Pacific is the largest market for TIMs, which is projected to register a high growth, in terms of value, between 2016 and 2021. Accelerating demand from end-use industries such as consumer electronics and telecom in Asia-Pacific is driving the TIMs market. Significant development in the electronics sector and increasing demand for miniaturization of electronic devices in various end-use industries such as consumer electronics and telecom are expected to drive the market in this region.

Although the thermal interface materials market is growing, a few factors restrict its growth. Maturity of the telecom and electronic industries in developed economies is a major restraint for the growth of the market. This has led to a gradual shift in demand and production of electronic chemicals and materials from North America to Asia-Pacific.

Companies such as Henkel AG & Co. KGaA (U.S.), Bergquist Company (U.S.), Indium Corporation (U.S.), Parker Chomerics (U.S.), Dow Corning (U.S.), Laird Technologies (U.S.), Momentive Performance Materials Inc. (U.S.), and Zalman Tech Co., Ltd. (South Korea) are the dominant market participants in the global TIMs market. Diverse product portfolio and technological advancements are a few factors responsible for the growth of these companies. These companies have been adopting various organic and inorganic growth strategies such as expansions and new product launches to enhance their market share for TIMs.

To speak to our analyst for a discussion on the above findings, click Speak to Analyst