Introduction

Older Updates Jun 9th: Added AMD Ryzen 3000 XT, Updated AMD Zen 3, Added AMD Zen 5, Updated AMD Renoir Desktop APU, Updated Intel Tremont, Updated Intel Alder Lake, Added Intel Jasper Lake, Updated Intel Sapphire Rapids, Updated Intel Meteor Lake, Added Intel Ice Lake-X (Server) and removed Ice Lake (desktop / mobile), Added Intel Elkhart Lake, Updated NVIDIA Ampere, Added NVIDIA RTX 3080 / RTX 3080 Ti / RTX 3090, Updated AMD Big Navi, Added AMD RX 5600M / RX 5700M, Updated AMD RDNA2, Updated AMD Radeon RX 5300 XT, Added GDDR6X Graphics Memory, Updated Intel Xe Graphics, Updated AMD B550 / A520 Chipset, Added TSMC 5 nanometer+, Updated TSMC 2 nanometer, Updated Samsung 5 nanometer, Added Intel 144-layer NAND Flash, Removed launched products: AMD Ryzen 3 3100 & Ryzen 3 3300X, Intel Comet Lake 10th Gen, Intel 400 Series chipsets, Removed RTX 2080 Ti Super, which definitely isn't going to launch, now that Ampere has been detailed

Apr 27th: Added AMD Renoir for Desktop, Added AMD Ryzen 3 3100 & Ryzen 3 3300X, Added AMD Zen 3 Cézanne APU, Updated AMD Zen 3, Updated Intel Comet Lake, Updated Intel Alder Lake, Updated AMD Arcturus, Added NVIDIA GeForce MX450, Updated Intel 400 Series Chipsets, Added AMD 600-Series Zen 3 Chipsets, Updated Hynix 128-layer Flash, Added Samsung 160-layer Flash, Updated TSMC 3-nanometer Process, Added TSMC 2-nanometer Process, Added Samsung 3-nanometer Process

Apr 6th: Updated Intel Comet Lake, Updated Intel Lakefield, Updated Intel Rocket Lake, Added RTX 2060 Super Mobile, Updated AMD RDNA2 Graphics Architecture, Added Intel 500-Series Chipsets, Updated DDR5 System Memory, Updated TSMC 5 nm process, Removed launched Athlon 3000 Mobile & Ryzen 4000 APUs / Renoir

Mar 12th: Updated AMD Zen 3 and Zen 4, Updated Intel Comet Lake, Added Intel Alder Lake, Updated VIA CenTaur, Updated AMD RDNA2, Added AMD RDNA3, Added AMD CDNA & CDNA2, Updated NVIDIA Ampere, Updated Intel Xe Graphics, Updated B550 Chipset, Updated DDR5 Memory, Updated PCI-Express 6.0, Removed launched Threadripper 3990X

Feb 12th: Updated Intel Comet Lake, Updated Intel Lakefield, Updated Intel Tiger Lake, Updated AMD Renoir APU, Updated VIA Centaur / Zhaoxin KaiXian, Separated AMD Arcturus and AMD RDNA2 into two separate sections, since Arcturus is based on Vega, Updated NVIDIA Ampere, Updated AMD Big Navi, Updated Intel Xe, Updated Intel 400-Series Chipsets, Updated DDR5 Memory, Updated Toshiba 128-Layer NAND Flash, Removed launched RX 5600 / RX 5600 XT

Jan 14th: Updated AMD Zen 3, Updated AMD Zen 4, Updated AMD Renoir Ryzen 4000 APU, Updated AMD Threadripper 3990X, Added AMD Athlon 3000 Mobile SOC, Added Intel Core i9-10990XE, Updated Intel Comet Lake, Updated Intel Tiger Lake, Updated VIA Centaur, Updated Intel Xe Discrete Graphics, Added NVIDIA Ampere, Added AMD Radeon RX 5600 / RX 5600 XT, Updated AMD Navi 12, Added AMD Big Navi, Updated AMD B550 / A520 Chipsets, Updated Hynix 4D NAND, Updated DDR5 System Memory, Updated TSMC 3 nanometer process, Removed launched products: RX 5500 / 5500 XT, new AMD Threadripper chipsets

Dec 2nd: Updated AMD Zen 3, Added AMD Threadripper 3990X, Updated AMD Renoir 3rd Gen APU, Updated Intel Tiger Lake, Updated Intel Comet Lake, Updated Intel Rocket Lake, Updated Intel Tremont, Updated Intel Cooper Lake, Added VIA CenTaur processor, Added NVIDIA RTX 2080 Ti Super, Added NVIDIA Hopper GPU architecture, Updated Intel Xe Graphics, Added Intel Ponte Vecchio GPU, Added Radeon RX 5300 XT, Updated Radeon RX 5500, Updated AMD Arcturus / RNDA2, Updated TSMC 5 nanometer, Added TSMC 3 nanometer, Removed launched products: Additional AMD Ryzen 3000 Zen 2 processors, Intel Cascade Lake, Cascade Lake-X, Threadripper 3rd Gen, Intel 9900KS, GTX 1660 Super, GTX 1650 Super

Oct 18th: Added Ryzen 7 3750X, Ryzen 9 3900 & Ryzen 5 3500X, Updated Threadripper 3rd Generation, Updated AMD Zen 3 & Zen 4, Updated Intel Core i9-9900KS, Updated Intel Ice Lake, Updated Intel Cascade Lake-X and marked as released, Updated Intel Tiger Lake, Updated Intel Sapphire Rapids, Added Intel Rocket Lake, Added Intel Meteor Lake, Updated Intel Xe, Added NVIDIA GTX 1660 Super, Updated NVIDIA GTX 1650 Ti, Added Radeon RX 5500 / Navi 14, Added AMD Radeon RX 5300 XT, Updated AMD Navi 12, Added AMD B550A Chipset, Updated AMD B550 Chipset, Updated Intel 400 Series Chipsets, Updated Updated AMD Threadripper 3rd Gen Chipsets, Added Micron 128-layer NAND Flash, Added TSMC N7+ EUV, Updated TSMC N6 & TSMC N5

Sep 4th: Updated Intel Comet Lake, Tiger Lake & Cooper Lake, Added AMD Ryzen 3500, Updated Threadripper 3rd Gen, Added AMD Renoir 3rd generation APU, Added Intel Tremont, Updated AMD Zen 3 & Zen 4, Added AMD Navi 12 / RX 5800, Added Threadripper 3rd Gen chipsets TRX40, TRX80, WRX80, Added Ryzen 3000 B550 & A520 chipsets, Updated HBM2e memory

Added Toshiba 5-bit-per-cell NAND Flash (PLC), Updated Toshiba XLFlash, Added Hynix 128-layer NAND Flash, Added PCI-Express 6.0, Marked USB 4.0 as "released" and updated some info, Removed AMD Z490 and X499, which never materialized, Removed GeForce RTX 2070 Ti, which looks like it really was a typo, considering RTX 2070 Super has been released in the meantime. Removed GeForce RTX 2050, which seems to have been scrapped in favor of GTX 1660 / 1660 Ti. Removed older launched products: AMD Ryzen 50th Anniversary, AMD Ryzen 3000 Matisse & Picasso, Intel 28-core i9-9990XE, RX 5700 Navi, X570, PCIe Gen 4.0 SSDs, PCI-Express 4.0.

Added Toshiba 5-bit-per-cell NAND Flash (PLC), Updated Toshiba XLFlash, Added Hynix 128-layer NAND Flash, Added PCI-Express 6.0, Marked USB 4.0 as "released" and updated some info, Removed AMD Z490 and X499, which never materialized, Removed GeForce RTX 2070 Ti, which looks like it really was a typo, considering RTX 2070 Super has been released in the meantime. Removed GeForce RTX 2050, which seems to have been scrapped in favor of GTX 1660 / 1660 Ti. Removed older launched products: AMD Ryzen 50th Anniversary, AMD Ryzen 3000 Matisse & Picasso, Intel 28-core i9-9990XE, RX 5700 Navi, X570, PCIe Gen 4.0 SSDs, PCI-Express 4.0. Jun 14th: Updated AMD Zen 2 / Ryzen 3000 and AMD Picasso APUs, Added Intel 9900KS, Intel Tiger Lake, Intel Sapphire Rapids, Intel Granite Lake, Updated Intel Ice Lake, Updated AMD Navi / Radeon RX 5700 Series and AMD Arcturus / RDNA 2, Added NVIDIA SUPER, Updated Intel Xe Graphics, Added AMD X570, Intel X499 / X299G, Intel 400 and Intel 495 Chipsets, Added TSMC 6 nanometer and Intel 7 nanometer processes, Updated PCI-Express 5.0, Added PCIe Gen 4.0 SSDs, Added USB 4.0, AMD Ryzen 50th Anniversary is launched now, Removed older launched products: GeForce GTX 1650, GTX 1660, Removed NVIDIA Volta and Ampere

Apr 29th: Added AMD Ryzen 50th Anniversary, Added AMD Ryzen 3000 APUs (Picasso), Added AMD Ryzen 3000 (Zen 2), Updated AMD Zen 3, Updated Intel Ice Lake, Updated Intel Comet Lake, Updated Intel Cascade Lake, which is released now, Added Intel Cascade Lake-X, Updated AMD Navi, Added GeForce GTX 1650 Ti, GeForce GTX 1650 and GTX 1660 have launched, Updated Intel Xe, Updated AMD X570 Chipset, Added HBM2e Memory, Added Intel CXL Interconnect, Added Toshiba 128-layer 3D NAND, Added TSMC 5 nanometer, Samsung 5 nanometer, Samsung 6 nanometer, Removed older launched products: Intel 9th gen Core KF, GeForce GTX 1660 Ti, Turing Mobile, Radeon VII, Vega 20

Feb 26th: Updated AMD Navi, Updated AMD Zen 2 / Ryzen 3000, Added AMD X570 chipset, Updated Intel discrete GPU, Updated Intel 28-core HEDT platform, Updated AMD Z490 chipset, Radeon VII and GTX 1660 Ti, RTX 20-Series Mobility, Intel 9th Gen Core KF are launched now, Removed older launched products: Ryzen 3000U APUs, GeForce GTX 1060 GDDR5X, GTX 2060, Intel B365 Express Chipset

Jan 17th: Removed "new Ryzen 2000 models"; these were launched as OEM-only, Added Ryzen 3000U Series APUs, Updated AMD Zen 2 / Ryzen 3000, Updated Intel Core "KF" SKUs, Added Intel "Lakefield" heterogenous processor, Added Intel Willow Cove and Golden Cove Cores, Added NVIDIA GeForce GTX 1660 Ti and TU116, RTX 2060 and GTX 1060 GDDR5X are now launched, Updated RTX 2060, Updated RTX 2050, Updated NVIDIA RTX Turing Mobile, Added AMD Radeon VII, Removed launched Polaris 30 / RX 590

Dec 19th: Updated Intel Ice Lake with information about "Sunny Cove" CPU cores and Gen11 iGPU, added Intel Willow Cove and Golden Cove CPU core early information, added Intel XE Discrete Graphics, added price and info for 28-core Intel Xeon W-3175X, added Intel 9th gen Core KF SKUs, added Ryzen 3 and Ryzen 5 3000U series mobile APUs, added first info about Ryzen 3000 from AMD Korea campaign, updated Zen 2 with client-segment Ryzen 3000-series probable launch dates, added Intel B365 Express chipset, updated NVIDIA RTX 2060;

Nov 29th: Added Intel Comet Lake, added NVIDIA GTX 1060 GDDR5X, added Intel Jupiter Sound, updated AMD Zen 2, updated Intel Arctic Sound, updated Intel Cascade Lake, updated DDR5 system memory, updated desktop Ryzen 2000 models: OEM only, Polaris 30 / RX 590 have been launched, removed launched QLC NAND flash, SSDs are in the market now from Samsung and Crucial

Nov 5th: Updated Zen 2, Added Zen 4, updated RTX 2070 Ti, updated Polaris 30 / RX 590, added Radeon MI-NEXT, updated PCIe 4.0, removed launched products: Ryzen Threadripper 2nd Generation, Intel Whiskey Lake, Skylake-X Refresh, GeForce 20 Turing, Intel Z390, GDDR6 graphics memory;

Oct 17th: Added Threadripper 2970WX and 2920 WX launch info, removed AMD B450, Whiskey Lake launched as "Coffee Lake Refresh", removed Bay Trail Refresh, Updated Intel 28-core SKL-X XCC, updated Intel Ice Lake, updated AMD Zen 2, NVIDIA Turing / GeForce 20 is launched, added GeForce RTX 2070 Ti, added GeForce 2060 & 2050, added NVIDIA Turing Mobile, updated NVIDIA Volta, updated AMD Vega 20, added AMD Polaris 30, added AMD Arcturus, GDDR6 launched with GeForce 20, QLC now launched with the introduction of first SSDs, added AMD X499 Chipset, added Intel Intel Z399 Chipset, updated Intel Discrete GPU;

Aug 16th: Cleanup of launched products, added Intel Whiskey Lake, Cooper Lake, Cascade Lake, X599, updated Intel Cannon Lake, Ice Lake, 28-core HEDT platform, updated AMD Ryzen 2000 new models, AMD Zen 2, added NVIDIA GeForce GTX 20-series, updated NVIDIA Turing, updated Intel Discrete GPU, updated GDDR6, added SK Hynix 4D NAND, Toshiba XL-FLASH;

July 17th: Expanded AMD Ryzen Threadripper II series, added new Ryzen 2000 models, added Intel Bay Trail platform processor lineup expansion, added New Intel 28-core HEDT platform derived from LGA3467, updated Intel Z390, added AMD Vega 20, added GeForce 11-series, added info on Samsung LPDDR5 DRAM, expanded on GDDR6; cleanup of launched products: AMD Zen+, Intel i7-8086K and NVIDIA GTX 1050 3 GB, AMD 400 and Intel 300 chipsets;

May 24th: Updated AMD Zen 2, Zen+ second wave, Threadripper 2nd Gen, added GDDR6 info for NVIDIA, added AMD B450 chipset, added QLC NAND flash, added NVIDIA GTX 1050 3 GB, updated NVIDIA Turing, updated Intel Cannon Lake, updated Intel Z390, Updated DDR5;

April 26: Cleanup of launched products: Zen+, Intel Q1 Coffee Lake models and AMD 400 Series chipsets; added Intel Core i7-8086K, Cannon Lake and Ice Lake, added AMD Z490 chipset info, added Intel Z390 and X399 chipsets;

March 16: Added specific Zen+ release date and added more info on Ryzen 2600X; added first vendor names for new Coffee Lake motherboards. Intel confirmed fixes against Spectre/Meltdown for new Coffee Lake CPUs. More details on CFL Celeron/Pentium CPUs, AMD Dali APU, and NVIDIA Turing release date were added as well. Fixed PCIe 4.0 release date typo.

Processors

AMD Cézanne Zen 3 APUs [updated]

Release Date: Probably 2021

Successor to "Renoir"

Built on Zen 3 CPU cores, paired with Vega GPU

Built on refined 7 nm process, N7P or N7+

Comes in 15 W and 45 W SKUs

"Van Gogh" APU is based on Zen 3, too, but uses RDNA2 iGPU, for ultra-low-end

Sources

www.techpowerup.com/269171/amd-cezanne-apu-to-stick-with-vega-igpu-van-gogh-gets-rdna2

www.techpowerup.com/266216/amd-renoir-successor-is-c-zanne-powered-by-zen-3-and-rdna2



AMD Zen 3 [updated]

Release Date: September 2020, possibly pushed back a bit because AMD is now talking about "Late 2020"

Design completed as of Aug 2019

Codename: Vermeer (CPU), Dali (APU w/ IGP), Milan (Server), Grey Hawk (Embedded), Genesis Peak (Threadripper)

Zen 3 refresh, possibly based on improved tech called "Warhol"

CCX removed, so that all cores on the CCD share a single large L3 cache

Continues to use Socket AM4 for desktop

Redesigned chiplets with 32+ MB shared L3 on each chiplet, as opposed to 2x 16 MB shared between CCX groups

Zen 3 processors are compatible with B450, X470, B550 and X570 motherboards (after BIOS flash)

Server platform codename "Genesis SP3"

Up to 64-cores (128-threads) across eight 8-core chiplets

120 - 225 W TDP

Clock frequencies: 3.8 to 4.0 GHz base, 4.4 to 4.6 GHz boost

64-core EPYC Milan clocked at 3.0 GHz

PCIe Gen 4

8-channel DDR4 memory

New process tech: 7 nm Plus (probably not 7 nm+ EUV)

20% increase in transistor density, 10% lower power consumption

Up to 15% IPC improvement + more from higher clock frequencies

Up to 50% faster floating point

Possibly support for AVX-512

New CPU core

Sources

www.techpowerup.com/270414/amd-confirms-zen-4-on-5nm-other-interesting-tidbits-from-q2-2020-earnings-call

www.techpowerup.com/267818/amd-5th-gen-ryzen-desktop-possibly-codenamed-warhol

www.techpowerup.com/269159/amd-ryzen-4000-vermeer-cpus-almost-ready-to-hit-the-market

www.techpowerup.com/269775/amd-64-core-epyc-milan-based-on-zen-3-could-ship-with-3-00-ghz-clocks

www.techpowerup.com/267358/amd-backpedals-zen-3-support-coming-to-b450-and-x470

www.techpowerup.com/267367/possible-amd-vermeer-clock-speeds-hint-at-ipc-gain

www.techpowerup.com/267775/msi-confirms-zen-3-support-on-its-amd-400-series-chipset-motherboards-with-16mb-roms

www.techpowerup.com/266374/amd-confirms-zen-3-and-rdna2-by-late-2020

www.techpowerup.com/264546/amd-sheds-light-on-the-missing-in-7nm-for-zen-3-and-rdna2-in-its-latest-presentation

www.techpowerup.com/262437/amd-ryzen-4000-rumored-to-offer-around-17-increased-performance

www.techpowerup.com/261455/amd-zen-3-microarchitecture-could-post-significant-performance-gains

www.techpowerup.com/259869/amd-zen-3-could-bid-the-ccx-farewell-feature-updated-smt

www.techpowerup.com/259139/amd-updates-roadmaps-to-lock-rdna2-and-zen-3-onto-7nm-with-2020-launch-window

www.techpowerup.com/258099/amd-designing-zen-4-for-2021-zen-3-completes-design-phase-out-in-2020

www.techpowerup.com/254656/amd-zen3-to-leverage-7nm-euv-for-20-transistor-density-increase

www.techpowerup.com/242213/amd-product-roadmap-slides-for-2020-leaked-castle-peak-tr4-and-dali

www.techpowerup.com/242166/amd-readies-ryzen-threadripper-skus-based-on-pinnacle-ridge-dies



AMD Zen 4

Release Date: 2021

"In Design" as of Nov 2018

"On Track" for 2021 launch as of Dec 9, 2019

5 nm TSMC process

DDR5 memory support

Improves IPC

Server platform codenamed "Genoa"

PCI-Express Gen 5

More cores per chiplet

Uses 3rd generation Infinity Fabric, which adds cache-coherent unified memory

Uses Socket SP5 for EPYC, new mainstream socket expected (AMD Socket AM5)

Sources

www.techpowerup.com/270414/amd-confirms-zen-4-on-5nm-other-interesting-tidbits-from-q2-2020-earnings-call

www.techpowerup.com/264545/amd-zen-4-microarchitecture-on-track-for-2021-22-debut-with-genoa

www.techpowerup.com/261944/amd-zen-4-2021-launch-on-track-as-tsmc-optimistic-about-5-nm

www.techpowerup.com/258099/amd-designing-zen-4-for-2021-zen-3-completes-design-phase-out-in-2020

Slide 51

www.techpowerup.com/259869/amd-zen-3-could-bid-the-ccx-farewell-feature-updated-smt



AMD Zen 5

Release Date: 2022

5 nm or 3 nm TSMC process

DDR5 memory support

PCI-Express Gen 5

Desktop codename: "Raphael"

APU codename: "Rembrandt"

Uses Socket SP5 for server, desktop uses Socket AM5

Sources

www.techpowerup.com/267695/distant-blips-on-the-amd-roadmap-surface-rembrandt-and-raphael



Intel Comet Lake KA [added]

Release date: Unknown, but must be soon, or it will conflict with Rocket Lake

Core i9-10900KA (BX8070110900KA), with a 3.7 GHz Base clock, for €525

Core i9-10850KA (BX8070110850KA) with a 3.6 GHz base clock, for €485

Core i9-10700KA (BX8070110700KA) with a 3.8 GHz base clock, for €408

Core i9-10600KA (X8070110600KA) with a 4.1 GHz base clock, for €278

Sources

www.techpowerup.com/270278/intel-10th-gen-core-i9-ka-series-listed-more-comet-lake-s-cpus-incoming



Intel Ice Lake Server [updated]

Release date: late 2020, re-confirmed as of Q2 2020

Ice Lake mobile was launched in late 2019

Ice Lake desktop was scrapped because it wasn't competitive with Comet Lake

Xeon codename "Whitley"

Uses new 4189-pin LGA socket

8-channel DDR4 interface

10 nanometer DUV (deep-ultraviolet) process

Brand-new CPU core design codenamed "Sunny Cove"

PCI-Express Gen 4.0

"GenuineIntel Family 6 Model 106 Stepping 4" processor: 24c/48t, 2.2 GHz base, 2.9 GHz boost, L1D 48 KB, L1I 32 KB, L2 1.25 MB, L3 36 MB

"GenuineIntel Family 6 Model 106 Stepping 5" processor: 28c/56t, 1.5 GHz base, 3.5 GHz boost, L1D 48 KB, L1I 32 KB, L2 1.25 MB, L3 42 MB

2x 28c CPU Geekbench SP = 3424, MP = 38079, EPYC 7742: SP = 4398, MP = 35492

Adds AVX512 instructions (so far available only on HEDT platform, since Skylake-X). New instructions: AVX512F, AVX512CD, AVX512DQ, AVX512BW, and AVX512VL. New commands: AVX512_IFMA and AVX512_VBMI

20-30% broadening of various number crunching resources, wider execution window, more AGUs

SHA-NI and Vector-AES instruction sets, up to 75% higher encryption performance vs. "Skylake"

Supports unganged memory mode

Integrated GPU based on new Gen11 architecture, up to 1 TFLOP/s ALU compute performance

Integrated GPU supports DisplayPort 1.4a and DSC for 5K and 8K monitor support

Gen11 also features tile-based rendering, one of NVIDIA's secret-sauce features

Integrated GPU supports VESA adaptive V-sync, all AMD FreeSync-capable monitors should work with this

Sources

www.techpowerup.com/270430/intel-ice-lake-sp-processors-get-benchmarked-against-amd-epyc-rome

www.techpowerup.com/267960/possible-intel-ice-lake-sp-24-core-xeon-processor-surfaces-on-geekbench-database

www.techpowerup.com/267746/intel-reassures-investors-of-its-server-processor-roadmap-ice-lake-sp-in-2020-sapphire-rapids-in-2021

www.techpowerup.com/268046/no-intel-rocket-lake-s-or-ice-lake-x-this-year

www.techpowerup.com/260130/intel-scraps-10nm-for-desktop-brazen-it-out-with-14nm-skylake-till-2022

www.techpowerup.com/260114/intel-core-i3-10100-put-through-sandra-beats-i3-9100-by-31-in-multimedia-tests

www.techpowerup.com/257732/intel-starts-shipping-10-nm-ice-lake-cpus-to-oems

www.techpowerup.com/260375/intel-10-nm-ice-lake-is-alive-server-and-desktop-support-added-to-the-linux-kernel

www.techpowerup.com/256050/intel-ice-lake-y-mcm-pictured-up-close

www.techpowerup.com/256596/intel-ice-lake-ipc-best-case-a-massive-40-uplift-over-skylake-18-on-average

www.techpowerup.com/256016/intel-10th-generation-core-case-badges-revealed

www.techpowerup.com/256007/intel-2019-computex-keynote-live-blog

www.techpowerup.com/254924/intel-10nm-ice-lake-to-quantitatively-debut-within-2019

www.techpowerup.com/253929/intel-ice-lake-gpu-docs-reveal-unganged-memory-mode

www.techpowerup.com/253928/intel-gen11-architecture-and-gt2-ice-lake-igpu-detailed

www.techpowerup.com/253958/several-gen11-gpu-variants-referenced-in-latest-intel-drivers

www.techpowerup.com/250570/intel-gen11-igpu-roughly-as-fast-as-radeon-vega-8-ryzen-3-2200g

www.techpowerup.com/250573/intel-10nm-ice-lake-to-combine-sunny-cove-cpu-cores-with-gen11-igpu

www.techpowerup.com/250571/intel-unveils-a-clean-slate-cpu-core-architecture-codenamed-sunny-cove

www.techpowerup.com/248159/intel-gen11-ice-lake-igpu-supports-displayport-1-4a-and-dsc-enabling-5k-and-8k

www.techpowerup.com/246306/intel-stuck-with-14nm-processors-till-holiday-2019

www.techpowerup.com/244393/in-wake-of-intels-10-nm-process-difficulties-analyst-firm-bumps-amds-share-outlook

www.techpowerup.com/234262/intel-announces-9th-gen-core-cannon-lake-on-track-ice-lake-taped-out

www.techpowerup.com/238014/intel-cannon-lake-could-bring-avx-512-instruction-set-to-the-mainstream

www.techpowerup.com/250549/intel-demoes-sunnycove-high-performance-core



Intel Ice Lake

Release Date: Late 2019 (mobile), desktop/server 2020

Ice Lake for desktop might be delayed even further (or scrapped completely) due to issues with the 10 nm process

Uses 10 nanometer DUV (deep-ultraviolet) process

Will use "Intel 10th gen" branding, with Core i3, i5 and i7

First processors are mobile quad-core designs

Ultra-low-power (ULP) platform was displayed at Computex: Using a multi-chip-module design, with TDP between 8 and 15 W

Mass production started in Q3 2019

Uses a brand-new CPU core design codenamed "Sunny Cove"

Adds AVX512 instructions (so far available only on HEDT platform, since Skylake-X). New instructions: AVX512F, AVX512CD, AVX512DQ, AVX512BW, and AVX512VL. New commands: AVX512_IFMA and AVX512_VBMI

20-30 broadening of various number crunching resources, wider execution window, more AGUs

SHA-NI and Vector-AES instruction sets, up to 75% higher encryption performance vs. "Skylake"

Supports unganged memory mode

First implementation will not be for a desktop processor, but a low-power SOC for notebooks (Ice Lake-U)

Ice Lake-U is 4-core/8-thread based on Sunny Cove w/ Gen 11 GT2 graphics with 64 EUs.

Ice Lake SP are Xeons "Whitley", which will launch in 2020.

Integrated GPU based on new Gen11 architecture, up to 1 TFLOP/s ALU compute performance

Integrated GPU supports DisplayPort 1.4a and DSC for 5K and 8K monitor support

Gen11 also features tile-based rendering, one of NVIDIA's secret-sauce features

Integrated GPU supports VESA adaptive V-sync, all AMD FreeSync-capable monitors should work with this

Sources

www.techpowerup.com/260130/intel-scraps-10nm-for-desktop-brazen-it-out-with-14nm-skylake-till-2022

www.techpowerup.com/260114/intel-core-i3-10100-put-through-sandra-beats-i3-9100-by-31-in-multimedia-tests

www.techpowerup.com/257732/intel-starts-shipping-10-nm-ice-lake-cpus-to-oems

www.techpowerup.com/260375/intel-10-nm-ice-lake-is-alive-server-and-desktop-support-added-to-the-linux-kernel

www.techpowerup.com/256050/intel-ice-lake-y-mcm-pictured-up-close

www.techpowerup.com/256596/intel-ice-lake-ipc-best-case-a-massive-40-uplift-over-skylake-18-on-average

www.techpowerup.com/256016/intel-10th-generation-core-case-badges-revealed

www.techpowerup.com/256007/intel-2019-computex-keynote-live-blog

www.techpowerup.com/254924/intel-10nm-ice-lake-to-quantitatively-debut-within-2019

www.techpowerup.com/253929/intel-ice-lake-gpu-docs-reveal-unganged-memory-mode

www.techpowerup.com/253928/intel-gen11-architecture-and-gt2-ice-lake-igpu-detailed

www.techpowerup.com/253958/several-gen11-gpu-variants-referenced-in-latest-intel-drivers

www.techpowerup.com/250570/intel-gen11-igpu-roughly-as-fast-as-radeon-vega-8-ryzen-3-2200g

www.techpowerup.com/250573/intel-10nm-ice-lake-to-combine-sunny-cove-cpu-cores-with-gen11-igpu

www.techpowerup.com/250571/intel-unveils-a-clean-slate-cpu-core-architecture-codenamed-sunny-cove

www.techpowerup.com/248159/intel-gen11-ice-lake-igpu-supports-displayport-1-4a-and-dsc-enabling-5k-and-8k

www.techpowerup.com/246306/intel-stuck-with-14nm-processors-till-holiday-2019

www.techpowerup.com/244393/in-wake-of-intels-10-nm-process-difficulties-analyst-firm-bumps-amds-share-outlook

www.techpowerup.com/234262/intel-announces-9th-gen-core-cannon-lake-on-track-ice-lake-taped-out

www.techpowerup.com/238014/intel-cannon-lake-could-bring-avx-512-instruction-set-to-the-mainstream www.techpowerup.com/250549/intel-demoes-sunnycove-high-performance-core



Intel Core i9-10990XE

Release Date: unknown, probably early 2020

22-cores + HyperThreading

Uses Cascade Lake-X architecture

LGA2066 Socket

1 MB L2 cache per core, 30.25 MB shared L3 cache

4 GHz base, up to 5 GHz boost

Roughly matches Threadripper 3960X in Cinebench

Sources

www.techpowerup.com/262915/core-i9-10990xe-22-core-processor-last-gasp-of-the-x299-platform



Intel Cannon Lake

Release Date: Additional processors delayed to 2019+, probably canceled

One mobile SKU launched in May: Core i3-8121U 2.2 GHz, no integrated graphics

Core M3 8114Y: 1.5 GHz base, 2.2 GHz boost, 4.5 W TDP, Intel UHD iGPU

10 nanometer production process

DDR4L support

Intel is reportedly having difficulties ramping up 10 nm, which could lead to delays

Adds AVX512 instructions (so far available only on HEDT platform, since Skylake-X). New instructions: AVX512F, AVX512CD, AVX512DQ, AVX512BW, and AVX512VL. New commands: AVX512_IFMA and AVX512_VBMI

Sources

www.techpowerup.com/244196/intel-core-i3-8121u-cannon-lake-processor-debuts-in-lenovo-ideapad-330-laptop

www.techpowerup.com/244323/intel-core-m3-8114y-cannon-lake-y-processor-surfaces-in-3dmark

www.techpowerup.com/244274/intel-cannon-lake-confirmed-to-feature-avx-512-instruction-set

www.techpowerup.com/244393/in-wake-of-intels-10-nm-process-difficulties-analyst-firm-bumps-amds-share-outlook

www.techpowerup.com/237197/intel-delays-10nm-cannon-lake-to-late-2018

www.techpowerup.com/234262/intel-announces-9th-gen-core-cannon-lake-on-track-ice-lake-taped-out

www.techpowerup.com/238014/intel-cannon-lake-could-bring-avx-512-instruction-set-to-the-mainstream



Intel Tiger Lake [updated]

Release Date: H2 2020

Possible announcement on Sept 2nd 2020

Intel reconfirmed "mid-2020" in their April 2020 Investor Call.

Mobile chip, succeeds "Lakefield"

CPU cores based on Willow Cove

Will be used in "Ghost Canyon" and "Panther Canyon" NUC

28 W TDP

Reorganized cache architecture

Produced on 10 nm+ process

Tiger Lake-Y: 4-core/8-thread, up to 5.0 GHz boost, 2.3 GHz base, 1.25 MB L2 cache per core, 12 MB L3 cache

Tiger Lake-U: 28 W TDP

Larger L1D (data) cache: 48 KB

L1I (instruction) cache: 32 KB

DDR4-3200 memory speed

Platform name "Corktown"

Adds support for LPDDR5 memory, up to 6.4 GT/s

PCI-Express Gen 4

Integrated GPU based on Intel Xe architecture (not Gen 11)

"Intel Iris Xe Graphics": 768 shaders, 96 EUs, 1.3 GHz

GPU performance comparable to 8 CU Radeon Vega iGPU

Cache size increased from 2 MB per-core to 3 MB per-core, so total 12 MB

"Double digit CPU performance increase", "Massive AI performance enhancement"

AVX512 supported

Uses 10 nm+ process

"Next-gen I/O", probably PCIe 4.0

Thunderbolt support

Core i7-1185G7 4.7 GHz Boost, 3DMark: 2922 CPU, 1296 GPU, overall 1414

Core i7-1165G7: 4c/8t, 15 W or 28 W, 2.8 GHz Base, 4.4 GHz Boost, 3DMark: 4750 CPU, 1150 GPU, overall 1297

Sources

www.techpowerup.com/269944/intel-has-something-big-to-share-on-september-2nd

www.techpowerup.com/269824/intel-apparently-reusing-iris-branding-for-xe-integrated-graphics-tiger-lake-with-768-shading-units-spotted

www.techpowerup.com/269453/intel-core-i7-1165g7-tiger-lake-mauls-ryzen-7-4700u-renoir-in-most-geekbench-tests

www.techpowerup.com/268029/intel-nuc-roadmap-peeking-into-2021-tiger-lake-nuc-by-2020-end

www.techpowerup.com/267524/intel-tiger-lake-processor-spotted-with-boost-of-5-ghz

www.techpowerup.com/267174/intel-tiger-lake-u-processor-with-relatively-high-clock-speed-spotted

www.techpowerup.com/266363/intel-core-i7-1185g7-tiger-lake-ships-with-4-70-ghz-turbo-boost-speeds

www.techpowerup.com/266638/intel-tiger-lake-and-lakefield-to-launch-around-september-october-2020

www.techpowerup.com/268234/intel-tiger-lake-beats-amd-renoir-in-graphics-tests-under-3d-mark

www.techpowerup.com/268047/intel-tiger-lake-vs-amd-renoir-a-pitched-battle-on-3dmark-database

www.techpowerup.com/268261/intel-tiger-lake-gen12-xe-igpu-compared-with-amd-renoir-vega-8-in-3dmark-night-raid

www.techpowerup.com/266185/intel-confirms-mid-2020-tiger-lake-launch

www.techpowerup.com/265886/intel-gen12-xe-igpu-could-match-amds-vega-based-igpus

www.techpowerup.com/265848/intels-next-generation-tiger-lake-u-core-i7-1165g7-cpu-score-leaks

www.techpowerup.com/263116/intel-panther-canyon-nuc-implements-tiger-lake-soc-with-xe-graphics

www.techpowerup.com/265496/intel-11th-gen-core-i7-1185g7-tiger-lake-cpu-benchmark-leaked

www.techpowerup.com/262787/intel-unveils-xe-dg1-sdv-graphics-card-demonstrates-intent-to-seriously-compete-in-the-gaming-space

www.techpowerup.com/262710/intel-2020-ces-conference-live-blog

www.techpowerup.com/261360/intel-tiger-lake-microarchitecture-features-hedt-like-cache-rebalancing

www.techpowerup.com/260547/intel-tiger-lake-u-processors-could-support-lpddr5-memory

www.techpowerup.com/259285/intel-adds-more-l3-cache-to-its-tiger-lake-cpus

www.techpowerup.com/258196/intel-tiger-lake-supports-pcie-gen-4-and-features-xe-graphics-phantom-canyon-nuc-detailed

www.techpowerup.com/255359/intel-tiger-lake-architecture-combines-willow-cove-cpu-cores-and-xe-igpu



Intel Tremont / Snow Ridge

Release Date: 2020

Pentium Silver SoC

Successor to Goldmont

Design-focus: single-threaded performance & battery life

Four cores

Crypto acceleration

L2 cache shared among 1-4 cores, up to 4.5 MB

Adds L3 cache

Intel Speed Shift

Intel Total Memory Encryption

Improved branch predictor

Fetch and decode pipeline updated, now 6-wide OoOE

32 KB data cache

Integrated GPU

10 nanometer

30% higher single-thread performance than Goldmont

Includes CLDEMOTE instruction, to invalidate cache lines

Also GFNU family of instructions and two AES units

Sources

www.techpowerup.com/268096/intel-sapphire-rapids-alder-lake-and-tremont-feature-cldemote-instruction

www.techpowerup.com/267466/intel-updates-x86-x64-software-developer-manual-with-tremont-architecture-details

www.techpowerup.com/260460/intel-introduces-tremont-microarchitecture

www.techpowerup.com/257382/intel-tremont-low-power-cpu-to-feature-l3-cache



Intel Willow Cove and Golden Cove Cores

Release Date: 2020 and 2021

Succeeds "Sunny Cove"

Willow Cove improves on-die caches, adds more security features, and takes advantage of 10 nm+ process improvements to increase clock speeds versus Sunny Cove

Golden Cove will add significant single-thread (IPC) increases over Sunny Cove, add on-die matrix multiplication hardware, improved 5G network-stack HSP performance, and more security features than Willow Cove

Sources

www.techpowerup.com/250571/intel-unveils-a-clean-slate-cpu-core-architecture-codenamed-sunny-cove



Intel Alder Lake [updated]

Release Date: H2 2021

Mixes CPU cores of various processing power (and energy consumption), similar to the Big.Little-like designs for mobile devices

Combines up to eight Golden Cove with up to eight Gracemont (Atom) cores

These cores have two different instruction sets, for example Golden Cove has AVX-512, TSX-NI and FP16, which Gracemont lacks

10 nm process

Uses Socket LGA1700

Desktop CPUs come in 125 W and 80 W

Could use Foveros 3D Stacking technology

Possible CPU configurations 8+8+1 (8 big cores, 8 small cores, GT1 integrated), and 6+0+1 (6 big cores, no small cores and GT1 integrated)

Includes Gen12 Xe iGPU

DDR5 memory support

PCI-Express 4.0 support, could introduce PCIe 5.0

Includes CLDEMOTE instruction, to invalidate cache lines

Sources

www.techpowerup.com/270251/intel-7nm-cpus-delayed-by-a-year-alder-lake-in-2h-2021-other-commentary-from-intel-management

www.techpowerup.com/269150/intel-alder-lake-s-confirmed-to-introduce-lga1700-socket-technical-docs-out-for-partners

www.techpowerup.com/269835/intel-alder-lake-cpu-core-segmentation-sketched

www.techpowerup.com/270163/intel-linux-patch-confirms-alder-lake-is-a-hybrid-core-processor

www.techpowerup.com/267064/intel-alder-lake-lga1700-to-feature-ddr5-rocket-lake-thermal-specs-leaked

www.techpowerup.com/266701/intels-next-lga1700-socket-to-last-over-two-generations

www.techpowerup.com/266606/intels-alder-lake-processors-could-use-foveros-3d-stacking-and-feature-16-cores

www.techpowerup.com/268096/intel-sapphire-rapids-alder-lake-and-tremont-feature-cldemote-instruction

www.techpowerup.com/264615/rumor-intel-to-introduce-big-little-architecture-for-desktop-with-alder-lake-s-new-lga-1700-socket



Intel Sapphire Rapids [updated]

Release Date: H2 2021

Successor to Cooper Lake

8-channel DDR5

Uses Socket LGA4677

For enterprise / data center

10 nm+ production process

Willow Cove CPU cores

PCIe 5.0

Probably 7 nm process

Platform name: Eagle Stream

Includes CLDEMOTE instruction, to invalidate cache lines

Sources

www.techpowerup.com/267746/intel-reassures-investors-of-its-server-processor-roadmap-ice-lake-sp-in-2020-sapphire-rapids-in-2021

www.techpowerup.com/268096/intel-sapphire-rapids-alder-lake-and-tremont-feature-cldemote-instruction

www.techpowerup.com/260119/intels-gargantuan-next-gen-enterprise-cpu-socket-is-lga4677

www.techpowerup.com/255826/intel-sapphire-rapids-brings-pcie-gen-5-and-ddr5-to-the-data-center



Intel Rocket Lake [updated]

Release Date: 2021, maybe even late 2020

A report from June 2020 suggests RKL might be delayed to 2021

Succeeds "Comet Lake"

Variants: Rocket Lake-"S" (mainstream desktop), -"H" (mainstream notebook), -"U" (ultrabook), and -"Y" (low power portable)

14 nanometer production process

Seems to be limited to eight cores (2 less than 10-core Comet Lake)

Some indication of mixed HyperThreading configurations, for example 8-core, 12-thread

Uses "Cypress Cove" core, which seems to be a backport of "Willow Cove" to 14 nm process

Up to 10% IPC improvement over Skylake

No FIVR, uses SVID VRM architecture

125 W maximum TDP

Compatible with 400-series chipsets

Possible they release 500-series chipsets with added features

Socket LGA1200 (just like Comet Lake)

Supports PCI-Express 4.0

20 PCIe lanes

Intel Xe integrated graphics, based on Gen 12 with HDMI 2.0b and DisplayPort 1.4a

Xe EU count only 32, Tiger Lake will have 96

2.5 Gb/s Ethernet, Thunderbolt 4, USB 3.2 20G

iGPU with up to 32 EUs

Memory support: DDR4-2933

32 KB L1I cache, 48 KB L1D cache, 512 KB per core L2 cache, and 16 MB shared L3 cache (8-core chip)

Engineering Sample: Family 6, Model 167, Stepping 0, 8c/16t, 3.4 GHz base, 5.0 GHz boost

Engineering Sample: Family 6, Model 167, Stepping 0, 8c/16t, 3.2 GHz base, 4.3 GHz boost

Sources

www.techpowerup.com/270344/intel-to-clock-rocket-lake-s-high-evidence-of-an-es-with-5-00-ghz-boost

www.techpowerup.com/268511/intel-willow-cove-backported-to-14nm-is-cypress-cove

www.techpowerup.com/269667/intel-core-i7-rocket-lake-chips-to-be-8-core-12-thread

www.techpowerup.com/270216/msi-references-11th-gen-rocket-lake-in-its-h410-based-prebuilt-manual

www.techpowerup.com/270341/intel-rocket-lake-cpus-will-bring-up-to-10-ipc-improvement-and-5-ghz-clocks

www.techpowerup.com/268045/intel-8-core-16-thread-rocket-lake-s-processor-engineering-sample-3dmarked

www.techpowerup.com/269164/intel-gen12-igpu-on-rocket-lake-will-be-slimmer-than-the-one-on-tiger-lake

www.techpowerup.com/264985/intel-rocket-lake-s-platform-detailed-features-pcie-4-0-and-xe-graphics

www.techpowerup.com/267064/intel-alder-lake-lga1700-to-feature-ddr5-rocket-lake-thermal-specs-leaked

www.techpowerup.com/267526/intel-rocket-lake-cpu-appears-with-6-cores-and-12-threads

www.techpowerup.com/266495/gigabyte-says-intel-z490-chipset-motherboards-will-support-11th-gen-rocket-lake-s

www.techpowerup.com/261735/intel-rocket-lake-an-adaptation-of-willow-cove-cpu-cores-on-14nm

www.techpowerup.com/261611/intel-rocket-lake-s-desktop-processor-comes-in-core-counts-up-to-8-gen12-igpu-included

www.techpowerup.com/260130/intel-scraps-10nm-for-desktop-brazen-it-out-with-14nm-skylake-till-2022



Intel Elkhart Lake

Release Date: Unknown

Produced on 10 nm process

Designed for next-gen Pentium Silver and Celeron processors

CPU cores use Tremont architecture

GPU uses Gen 11

Dual-core and Quad-core configurations

Single-channel memory controller with DDR4 and LPDDR4/x support

Engineering sample: 1.9 GHz, 5/9/12 W TDP

Sources

www.techpowerup.com/267828/intel-elkhart-lake-processor-put-through-3dmark

www.techpowerup.com/267686/intel-elkhart-lake-atom-processor-surfaces-on-chinese-components-marketplace-tremont-meets-gen11



Intel Meteor Lake

Release Date: 2022

Succeeds "Alder Lake"

New microarchitecture, more advanced than "Willow Cove", possibly "Golden Cove"

Produced on 7 nm EUV Intel process

Sources

www.techpowerup.com/266331/intels-first-7nm-client-microarchitecture-is-meteor-lake

www.techpowerup.com/260130/intel-scraps-10nm-for-desktop-brazen-it-out-with-14nm-skylake-till-2022



Intel Jasper Lake

Release Date: Unknown

Uses Tremont architecture

10 nm production process

Successor to Gemini Lake

ES: 4c/4t, 1.1 GHz Base, 1.12 GHz Boost

DDR4 memory support

Sources

www.techpowerup.com/267275/intel-jasper-lake-cpu-appears-with-gen11-graphics



Intel Granite Rapids

Release Date: 2022

Successor to Sapphire Rapids

8-channel DDR5

For enterprise / data center

PCIe 5.0

Probably 7 nm+ process

Platform name: Eagle Stream

Sources

www.techpowerup.com/255826/intel-sapphire-rapids-brings-pcie-gen-5-and-ddr5-to-the-data-center



VIA CenTaur / Zhaoxin KaiXian

Release Date: H2 2020

Eight-core 64-bit CPU, 2.5 GHz

AVX-512 supported

16 nm FinFET TSMC

195 mm² die size

Use LGA socket

Codename: "CHA", pronounced "C-H-A"

Separate AI co-processor "NCORE"

All cores + NCORE connected using a ring bus

Integrated VIA S3 graphics with DirectX 11.1

16 MB shared L3 cache

Four-channel DDR4-3200 memory support

44 PCI-Express 3.0 lanes

Sold as Zhaoxin KaiXian KX-6780A in China (end of Jan 2020): 8 core, 8 threads, 2.7 GHz, 8 MB cache, dual-channel DDR4-3200

Southbridge integrated

Multi-socket capable

Sources

www.techpowerup.com/263978/via-centaur-cha-ncore-ai-cpu-pictured-a-socketed-lga-package

www.techpowerup.com/264171/ruijie-rg-ct7800-mini-pc-among-first-zhaoxin-kaixian-designs-tip-of-chinas-3-5-2-spear

www.techpowerup.com/263419/zhaoxin-kaixian-x86-processor-now-commercially-available-to-the-diy-channel

www.techpowerup.com/261979/centaur-releases-in-depth-analysis-from-the-linley-group-for-its-ncore-equipped-x86-processor

www.techpowerup.com/261274/via-centaur-develops-a-multi-core-x86-processor-for-enterprise-with-in-built-ai-hardware



Graphics / GPUs

NVIDIA RTX 3080 / RTX 3080 Ti / RTX 3090 [updated]

Release Date: Fall 2020

Based on GA102 GPU

Common PCB design PG132

Uses the leaked cooler design, which is made by Foxconn and BYD (Build Your Dreams)

ASUS Leaked RTX 3080 Ti Strix is triple slot, triple fan

NVIDIA Titan Ampere: GA102-400-A1, 5376 shaders, 24 GB GDDR6X, 17 Gbps

RTX 3090: GA102-300-A1, 5248 shaders, 24 GB or 12 GB GDDR6X, 21 Gbps, 384-bit memory bus, 350 W

RTX 3080 Ti: 11 GB GDDR6X, 352-bit memory bus, 320 W

RTX 3080: GA102-200-Kx-A1, 10 GB GDDR6X, 19 Gbps, 320-bit memory bus

RTX 3080 is 30% faster than RTX 2080 Ti in 3DMark Time Spy

Sources

www.techpowerup.com/268278/nvidias-next-gen-reference-cooler-costs-usd-150-by-itself-to-feature-in-three-skus

www.techpowerup.com/268332/nvidia-ampere-cooling-solution-heatsink-pictured-rumors-of-airflow-magic-quashed

www.techpowerup.com/268565/nvidia-geforce-rtx-3090-and-rtx-3080-production-timeline-revealed

www.techpowerup.com/268821/nvidia-geforce-ampere-hits-3dmark-time-spy-charts-30-faster-than-rtx-2080-ti

www.techpowerup.com/269328/asus-rog-strix-geforce-rtx-3080-ti-leaked

www.techpowerup.com/268733/possible-nvidia-geforce-rtx-3090-rtx-3080-and-titan-ampere-specs-surface

www.techpowerup.com/266959/nvidia-rtx-3080-ti-and-ga102-ampere-specs-other-juicy-bits-revealed

www.techpowerup.com/268212/nvidia-geforce-rtx-3080-rendered-by-fan

www.techpowerup.com/268139/nvidia-geforce-rtx-3080-pictured



NVIDIA RTX 3070 / RTX 3070 Ti [added]

Release Date: Fall 2020

Based on GA104 GPU

GA104-400 for RTX 3070

GA104-300 for RTX 3070 Ti

GDDR6 memory on RTX 3070 non-Ti, GDDR6X on RTX 3070 Ti

Sources

www.techpowerup.com/269511/nvidia-geforce-rtx-3070-and-rtx-3070-ti-rumored-specifications-appear



NVIDIA RTX 2060 Super Mobile

Release Date: 2020

Based on TU106 GPU

2,176 shaders, just like desktop RTX 2060 Super

136 TMUs, 64 ROPs, 272 tensor cores, 34 RT cores

8 GB GDDR6, 256-bit bus

1305 MHz GPU base clock, 1486 MHz Boost

14 Gbps memory

An additional MaxQ SKU seems likely

Sources

www.techpowerup.com/265460/nvidia-geforce-rtx-2060-super-mobile-specs-leaked



NVIDIA GeForce MX450 Mobile

Release Date: Unknown

Based on TU117 GPU

GPU clock 540 MHz, 2 GB GDDR6 at 2505 MHz

TSMC 12 nanometer process

1024 shaders, 64 TMUs, 32 ROPs

Sources

www.techpowerup.com/265700/leaked-benchmark-shows-possible-nvidia-mx450-with-gddr6-memory



NVIDIA Ampere [updated]

Release Date: H2 2020 (GeForce)

Announced: May 2020 (only architecture, nothing on GeForce)

Successor to "Turing" architecture

GeForce RTX 3000 Series

Engineering Sample: 7936 CUDA cores, 124 CUs, at 1.1 GHz, 32 GB VRAM

Engineering Sample: 7552 CUDA cores, 118 CUs, at 1.2 GHz, 24 GB VRAM

Engineering Sample: 6912 CUDA cores, 108 CUs, at 1.01 GHz, 47 GB VRAM

GA100 GPU: 826 mm², 54 billion transistors, 6912 CUDA cores, 3456 FP64 cores, 432 tensor cores, 108 SM, 40 GB HBM2E 6144-bit

GA103 is used on GeForce RTX 3080, 60 SMs = 3840 CUDA cores, 320-bit memory, 10 or 20 GB GDDR6

GA104 is used on GeForce RTX 3070, 40 SMs = 3072 CUDA cores, 256-bit memory, 8 or 16 GB GDDR6

Produced on 7 nm TSMC, and/or 8 nm Samsung process

Updated Tensor cores, with double-precision FP64

PCI-Express 4.0 supported

Half the power consumption

Twice the performance (possibly for raytracing workloads)

Tesla server cards are going into Indiana University Big Red 200 supercomputer

NVIDIA will introduce a 12-pin power connector with Ampere, whether that is Tesla or Quadro only, or also affects GeForce is unknown at this time

Sources

www.techpowerup.com/269957/the-curious-case-of-the-12-pin-power-connector-its-real-and-coming-with-nvidia-ampere-gpus

www.techpowerup.com/268278/nvidias-next-gen-reference-cooler-costs-usd-150-by-itself-to-feature-in-three-skus

www.techpowerup.com/268332/nvidia-ampere-cooling-solution-heatsink-pictured-rumors-of-airflow-magic-quashed

www.techpowerup.com/269347/nvidia-geforce-ampere-gpus-built-on-samsung-8nm-instead-of-tsmc-7nm

www.techpowerup.com/267106/nvidia-ga100-scalar-processor-specs-sheet-released

www.techpowerup.com/267105/nvidia-announces-double-precision-fp64-tensor-cores-with-ampere

www.techpowerup.com/267099/nvidia-ceo-introduces-nvidia-ampere-architecture-nvidia-a100-gpu

www.techpowerup.com/267090/nvidia-ampere-designed-for-both-hpc-and-geforce-quadro

www.techpowerup.com/267088/nvidia-tesla-a100-ampere-aic-add-in-card-form-factor-board-pictured

www.techpowerup.com/267079/nvidia-ampere-a100-has-54-billion-transistors-worlds-largest-7nm-chip

www.techpowerup.com/267078/nvidia-tesla-a100-gpu-pictured

www.techpowerup.com/264359/three-unknown-nvidia-gpus-geekbench-compute-score-leaked-possibly-ampere

www.techpowerup.com/263489/nvidias-next-generation-ampere-gpus-could-have-18-teraflops-of-compute-performance

www.techpowerup.com/263128/rumor-nvidias-next-generation-geforce-rtx-3080-and-rtx-3070-ampere-graphics-cards-detailed

www.techpowerup.com/262592/nvidias-next-generation-ampere-gpus-to-be-50-faster-than-turing-at-half-the-power



NVIDIA Hopper

Release Date: unknown

Successor to "Ampere" architecture

MCM (multi-chip module) GPU packages

Seems to be for workstation/compute only

Sources

www.techpowerup.com/261980/nvidia-files-for-hopper-and-aerial-trademarks

www.techpowerup.com/261164/nvidia-ampere-successor-reportedly-codenamed-hopper



AMD Radeon RX 5300 XT

Release date: unknown

24 Compute Units / 1536 Stream Processors

3 GB GDDR6 memory, 96-bit

7 nanometer production process

Probably based on Navi 14 GPU

Sources

www.techpowerup.com/267720/amd-radeon-rx-5300-desktop-surfaces-on-geekbench

www.techpowerup.com/261237/desktop-amd-radeon-rx-5300-xt-rears-its-head-in-hp-specs-sheet



AMD Radeon RX 5600M and RX 5700M

Release date: unknown

Based on Navi 10 silicon

7 nanometer production process

RX 5700M: 2304 shaders, 144 TMUs, 64 ROPS, 8 GB GDDR6 memory, 256-bit, 1620-1720 MHz

RX 5600M: 2304 shaders, 144 TMUs, 64 ROPS, 6 GB GDDR6 memory, 192-bit, 1190-1265 MHz

Sources

www.techpowerup.com/266753/amd-coming-around-to-launching-the-radeon-rx-5600m-and-rx-5700m



Big Navi / Navi 20 / Navi 21

Release Date: September 2020

Uses RDNA2 graphics architecture

7 nanometer, possibly 7 nm+ EUV

Codename could be "Sienna Cichlid"

Goes up against NVIDIA high-end Ampere

RX 5950 XT, RX 5950, and RX 5800 XT

Navi 21: 2x Navi 10, 80 CU, 5120 Stream Processors

Aims to provide playable 4K framerates

Lisa Su in a CES 2020 interview said "we will have a high-end Navi [...] it is important"

AMD CFO: "Big Navi" will be a halo product and not merely a lofty performance increase over the RX 5700 XT to make AMD competitive against GeForce "Ampere."

Adds support for DirectX 12 Ultimate: variable-rate shading and hardware-accelerated ray-tracing (DXR version 1.1)

Sources

www.techpowerup.com/267611/amd-rdna2-navi-21-gpu-to-double-cu-count-over-navi-10

www.techpowerup.com/267474/amd-rdna2-based-radeon-rx-graphics-cards-launching-this-september

www.techpowerup.com/268039/september-unveil-makes-big-navi-not-next-gen-consoles-amds-rdna2-debutante

www.techpowerup.com/267955/amd-sienna-cichlid-could-be-big-navi

www.techpowerup.com/262951/rx-5950-xt-rx-5950-and-rx-5800-xt-new-amd-radeon-skus-reach-regulators

www.techpowerup.com/262741/expect-high-end-navi-amd-ceo



AMD RDNA 2

Release Date: September 2020

Lisa Su: "we will have our new next-generation RDNA architecture that will be part our 2020 lineup"

TSMC, 7 nm Plus (probably not 7 nm+ EUV)

Up to 18% higher transistor density

Higher clock speeds than RDNA

50% better performance per Watt than RDNA, twice the efficiency as GCN

Adds variable rate shading

Adds support for BFloat16

Adds hardware raytracing acceleration (DXR version 1.1)

Supports Microsoft DirectX 12 Ultimate API /DXR, VRS, Mesh Shaders & Sampler Feedback)

Same GPU architecture powers PlayStation 5 & Xbox Series X

Sources

www.techpowerup.com/268039/september-unveil-makes-big-navi-not-next-gen-consoles-amds-rdna2-debutante

www.techpowerup.com/267474/amd-rdna2-based-radeon-rx-graphics-cards-launching-this-september

www.techpowerup.com/264934/amd-rdna-2-gpus-to-support-the-directx-12-ultimate-api

www.techpowerup.com/264546/amd-sheds-light-on-the-missing-in-7nm-for-zen-3-and-rdna2-in-its-latest-presentation

www.techpowerup.com/264538/amd-rdna2-graphics-architecture-detailed-offers-50-perf-per-watt-over-rdna

www.techpowerup.com/266374/amd-confirms-zen-3-and-rdna2-by-late-2020

www.techpowerup.com/264529/amd-financial-analyst-day-2020-live-blog

www.techpowerup.com/263384/amd-to-debut-2nd-gen-rdna-architecture-in-2020

www.techpowerup.com/261291/amd-could-launch-next-generation-rdna-2-gpus-at-ces-2020

www.techpowerup.com/260344/future-amd-gpu-architecture-to-implement-bfloat16-hardware

www.techpowerup.com/259139/amd-updates-roadmaps-to-lock-rdna2-and-zen-3-onto-7nm-with-2020-launch-window

www.techpowerup.com/256459/amd-radeon-rx-5700-xt-confirmed-to-feature-64-rops-architecture-brief



AMD RDNA 3

Release Date: Late 2021 or 2022

"Advanced Node", probably TSMC 6 nm or 5 nm

Sources

www.techpowerup.com/264538/amd-rdna2-graphics-architecture-detailed-offers-50-perf-per-watt-over-rdna#g264538-1

www.techpowerup.com/264529/amd-financial-analyst-day-2020-live-blog



AMD CDNA and CDNA2 [updated]

Release Date: 2020 for CDNA and 2021-2022 for CDNA2

New architecture that focuses on compute for "Radeon Instinct"

TSMC 7 nm or 7 nm+

128 Compute Units = 8192 shaders

Arcturus engineering sample has 120 CUs (7680 shaders), 878 MHz for the core clock, 750 MHz SoC clock, and 1200 MHz memory clock

Compute only—Rasterization, display controllers and media encoding hardware removed

Product name: Radeon Instinct MI100

1000 MHz memory clock: 1 TB/s memory bandwidth

GPU clock up to 1334 MHz

200 W TDP

CDNA seems to be very similar to Vega

Add Tensor cores like on NVIDIA

Uses 32 GB HBM2 or HBM2E memory from Hynix and Samsung

Infinity Fabric link to pool multiple GPUs

CDNA2 implements Infinity Fabric gen 3.0 to support vast memory pools and cache-coherent unified memory access

Adds support for BFloat16

Sources

www.techpowerup.com/268657/amd-confirms-cdna-based-radeon-instinct-mi100-coming-to-hpc-workloads-in-2h2020

www.techpowerup.com/264536/amd-announces-the-cdna-and-cdna2-compute-gpu-architectures

www.techpowerup.com/264529/amd-financial-analyst-day-2020-live-blog

www.techpowerup.com/266164/amds-next-generation-radeon-instinct-arcturus-test-board-features-120-cus

www.techpowerup.com/263743/amd-radeon-instinct-mi100-arcturus-hits-the-radar-we-have-its-bios

www.techpowerup.com/260344/future-amd-gpu-architecture-to-implement-bfloat16-hardware

www.techpowerup.com/247976/amd-navi-gpu-architecture-successor-codenamed-arcturus

www.techpowerup.com/256459/amd-radeon-rx-5700-xt-confirmed-to-feature-64-rops-architecture-brief



Intel Xe Discrete Graphics [updated]

Release Date: mid-2020

Intel has scheduled a presentation event for August 13th, also Hot Chips Conference presentation on August 17th

Announcement: Xe DG1-SDV (Software Development Vehicle) announced at CES 2020 (Jan 9th 2020)

First Intel Discrete GPU since ill-fated Larrabee

New architecture built from the ground up, and not an upscale of Gen 11

Developer kit shipping as of Q4 2019, called "Discrete Graphics DG1 External FRD1 Accessory Kit (Alpha) Developer Kit"

SDV OpenCL performance in Geekbench: 55373 points, with 3.53 Gpixels/s in "Sorbel," 1.30 Gpixels/sec in Histogram Equalization, 16 GFLOPs in SFFT, 1.62 GPixels/s in Gaussian Blur, 4.51 Msubwindows/s in Face Detection, 2.88 Gpixels/s in RAW, 327.4 Mpixels/s in DoF, and 13656 FPS in Particle Physics. Roughly matches 11 CU Vega Picasso IGP

SDV is 15.2 cm long, 96 Execution Units, PCI-Express x16, slot only power (so 75 W), 3x DisplayPort, 1x HDMI, high noise levels

Up to 2x performance uplift for Intel Xe integrated graphics over previous Gen 11

Using a multi-chip design approach, with Foveros, Intel Xe scales up to 512 EUs with 500 W

512 EU model is datacenter only, 300 W 256 EU model for enthusiast markets

Targeted at 1080p gameplay, CES demonstration showed working gameplay on Destiny 2

Could be produced at Samsung to leverage their 10 nm tech, while Intel ramps up its own

Future Xe GPUs could be built on TSMC 6 nm and 3 nm nodes

Raytracing hardware acceleration support will definitely be included on the data-center GPUs (and probably on the consumer models, too)

Double-digit TFLOP/s scaling all the way up to 0.1+ PFLOP/s

Will be used in upcoming Cray Aurora Supercomputer for Argonne National Laboratory in 2021

Targeting a wide segment of markets, including consumer (client-segment) graphics, enthusiast-segment, and data-center compute

Uses new graphics control panel that's being introduced during 2019

Sources

www.techpowerup.com/270333/intel-to-detail-xe-graphics-on-august-13

www.techpowerup.com/267309/intel-gen12-xe-dg1-opencl-performance-geekbenched

www.techpowerup.com/266920/intel-xe-dg1-silicon-not-meant-for-desktop-add-on-cards-only-as-an-mgpu

www.techpowerup.com/264637/intel-courts-tsmc-6nm-and-3nm-nodes-for-future-xe-gpu-generations

www.techpowerup.com/266513/intel-teases-big-daddy-xe-hp-gpu

www.techpowerup.com/263763/intel-xe-graphics-to-feature-mcm-like-configurations-up-to-512-eu-on-500-w-tdp

www.techpowerup.com/262787/intel-unveils-xe-dg1-sdv-graphics-card-demonstrates-intent-to-seriously-compete-in-the-gaming-space

www.techpowerup.com/262710/intel-2020-ces-conference-live-blog

www.techpowerup.com/262404/intel-dg1-discrete-gpu-shows-up-with-96-execution-units

www.techpowerup.com/260524/intel-powers-on-the-first-xe-graphics-card-with-dev-kits-supposedly-shipping

www.techpowerup.com/260236/intel-could-unveil-first-discrete-10-nm-gpus-in-mid-2020

www.techpowerup.com/259978/intel-mobility-xe-gpus-to-feature-up-to-twice-the-performance-of-previous-igpus

www.techpowerup.com/259118/intel-says-its-upcoming-gen12-gpus-will-feature-biggest-architecture-change-in-a-decade

www.techpowerup.com/255073/intel-xe-gpus-to-support-raytracing-hardware-acceleration

www.techpowerup.com/254720/intel-courting-samsung-to-manufacture-xe-gpus

www.techpowerup.com/253897/without-silicon-intel-scores-first-exascale-computer-design-win-for-xe-graphics-aurora-supercomputer

www.techpowerup.com/253942/intel-introduces-its-new-graphics-command-center-app-paving-the-way-for-intel-xe

www.techpowerup.com/250576/intel-xe-kicks-the-door-open-to-challenge-the-geforce-radeon-duopoly



Intel Discrete GPU / Arctic Sound

Release Date: 2020

Intel will hold a world tour in 2019, to build enthusiasm for the new architecture

Advanced management for power and clocks

Test chip: 8x8 mm² die area, 1.54B transistors, 14 nm, 50-400 MHz clock, EUs at 2x clock if needed

Raja Koduri who left AMD in late 2017 is somehow involved

Confirmed to support VESA Adaptive Sync

Sources

www.techpowerup.com/252823/intel-invites-gamers-for-a-graphics-odyssey-spanning-multiple-continents

www.techpowerup.com/250032/intel-detailing-their-arctic-sound-discrete-gpu-this-december-aiming-for-2020

www.techpowerup.com/247243/intels-chris-hook-confirms-commitment-to-support-vesa-adaptive-sync-on-intel-gpus

www.techpowerup.com/246808/intel-teases-their-upcoming-graphics-cards-for-2020

www.techpowerup.com/243994/intel-could-unveil-its-graphics-card-at-2019-ces

www.techpowerup.com/241669/intel-unveils-discrete-gpu-prototype-development



Intel Ponte Vecchio [updated]

Release Date: 2021 or 2022

Discrete GPU

Produced on 7 nanometer production process

Probably not 7 nanometer Intel but 7 nm TSMC or even 6 nm TSMC

Multiple GPU dies will be combined into a single accelerator

Architected "for HPC modeling and simulation workloads and AI training"

Workloads can be processed by GPU and CPU at the same time, using Intel oneAPI

Foveros packaging technology

Xe link to combine multiple GPUs (CXL interconnect)

Sources

www.techpowerup.com/270251/intel-7nm-cpus-delayed-by-a-year-alder-lake-in-2h-2021-other-commentary-from-intel-management

www.techpowerup.com/261125/7nm-intel-xe-gpus-codenamed-ponte-vecchio

www.techpowerup.com/261233/intel-announces-new-gpu-architecture-and-oneapi-for-unified-software-stack-at-sc19



Intel Jupiter Sound

Release Date: 2022

Discrete GPU

Produced on 10 nanometer production process

Successor to Arctic Sound

Sources

www.techpowerup.com/240625/intel-could-ditch-amd-dgpu-die-on-future-core-g-series-mcms-with-arctic-sound



Zhaoxin Discrete GPU [added]

Release Date: Unknown

Discrete GPU

Produced on 28 nanometer production process

70 Watt TDP

Based on VIA S3 graphics IP

Sources

www.techpowerup.com/269657/zhaoxin-to-design-discrete-gpus



Chipsets

Intel X399

Release Date: unknown

Supports Coffee Lake-X and Cannon Lake-X

Sources

www.techpowerup.com/244179/intel-z390-express-chipset-detailed

www.techpowerup.com/243877/amd-intel-roadmaps-for-2018-leaked

www.techpowerup.com/243671/intel-confirms-z390-and-x399-chipsets-in-official-documents



Intel X499 / X299G

Release Date: Originally late 2019, either postponed or canceled

Will be used with Intel's new Core X HEDT processors, probably Cascade Lake X

Apparently renamed from X499 to X299G—At Computex Gigabyte showed motherboards with "X499" print covered by "X299G" stickers

Sources

www.techpowerup.com/256147/x499-or-x299g-intels-fall-2019-hedt-update-heralds-a-new-chipset



Intel X599

Release Date: Unknown

Supports new Intel 28-core HEDT platform

New motherboards, with new socket: LGA3647

Based on C629 Server Chipset

6-channel memory

48 PCIe lanes

Sources

www.techpowerup.com/248075/intel-hedt-platform-to-be-forked-into-z399-and-x599

www.techpowerup.com/246774/intel-x599-chipset-to-drive-28-core-hedt-platform



Intel Z399

Release Date: Unknown

New HEDT chipset

Sibling chipset to X599

Socket LGA2066

For 20- and 22-core CPUs

Works with existing Skylake-X LCC and HCC chips

Sources

www.techpowerup.com/248075/intel-hedt-platform-to-be-forked-into-z399-and-x599



Intel 500 Series Chipsets

Release Date: 2021 or late 2020

For Rocket Lake processors

Socket LGA1200

PCI-Express 4.0

2.5 Gb/s Ethernet, Thunderbolt 4, USB 3.2 20G

Sources

www.techpowerup.com/264985/intel-rocket-lake-s-platform-detailed-features-pcie-4-0-and-xe-graphics



Intel 495 Series Chipsets

Release Date: Unknown

Chipset lineup for use with Ice Lake processors

Sources

www.techpowerup.com/255383/intel-drivers-reveal-400-495-series-chipsets-for-comet-lake-ice-lake-new-year-new-socket-same-14-nm-process



AMD A520 Chipset [updated]

Release Date: 2020

Supports Ryzen 3000 Zen 2 processors and upcoming Zen 3 CPUs

Lower cost motherboard option than B550, for Zen 2

PCI-Express 4.0 for CPU storage and graphics

Other general purpose lanes are PCIe Gen 3

Dual GPU support

5-7 W TDP, no fan required

2x USB 3.2 Gen2, 6x USB 2.0, 4 + 4 SATA3

Socket AM4

Designed by ASMedia

Sources

www.techpowerup.com/268105/asrock-registers-10-new-amd-a520-chipset-motherboards-with-the-eec

www.techpowerup.com/266761/five-amd-a520-chipset-motherboards-listed-by-asus

www.techpowerup.com/262696/new-report-pins-asmedia-b550-and-a520-chipset-production-to-begin-only-in-q1-2020

www.techpowerup.com/256593/amd-b550-and-a520-lack-pcie-gen-4-capabilities

www.techpowerup.com/256547/asmedia-sourced-amd-b550-a520-chipset-motherboards-arrive-in-2020



AMD B550A Chipset

Release Date: Q4 2019

Supports Ryzen 3000 Zen 2 processors

Rebranded version of B450 chipset for low-cost motherboards, targeted at OEMs

PCI-Express 3.0 (not 4.0)

Socket AM4

Sources

www.techpowerup.com/263868/asrock-b550am-gaming-motherboard-pictured-up-close

www.techpowerup.com/260185/asrock-amd-b550am-gaming-motherboard-spied



AMD 600-Series Chipsets

Release Date: September 2020, at the same time as Zen 3

Socket AM4

Supporting Zen 3 Ryzen 4000 processors

Support for older CPUs very likely, probably at least Ryzen 3000

PCI-Express 4.0

Sources

www.techpowerup.com/265585/amd-4th-gen-ryzen-desktop-processors-to-launch-around-september-2020



Memory

DDR5 System Memory [updated]

Release Date: Late 2020, probably 2021

JEDEC standard finalized as of Jul 15th 2020

Demo'd in May 2018 by Micron: DDR5-4400

Samsung 16 Gb DDR5 DRAM developed since February 2018

Samsung has completed functional testing and validation of a LPDDR5 prototype: 10 nm class, 8 Gbit, final clocks: DDR5-5500 and DDR5-6400

SK Hynix has 16 Gb DDR5-5200 samples ready, 1.1 V, mass production expected 2020

April 2020: Hynix has 8.4 Gbps DDR5, minimum density per die is 8 Gbit, maximum is 64 Gbit

ECC is now supported by all dies (no longer specific to server memory modules)

SK Hynix demonstrated DDR5 RDIMM modules at CES 2020: 4800 MHz, 64 GB

Micron is shipping LPDDR5 for use in Xiaomi phones (Feb 2 2020). 5.5 Gbps and 6.4 Gbps

Samsung has begun production for LPDDR5 for mobile devices (Feb 25 2020). 16 GB, 5.5 Gbps

4800 - 6400 Mbps

Expected to be produced using 7 nm technologies

32 banks, 8 bank groups

64-bit link at 1.1 V

Burst length doubled to BL16

Bank count increased from 16 to 32

Fine grain refresh feature

Improved power efficiency enabled by Vdd going from 1.2 V to 1.1 V as compared to DDR4

On-die ECC

Voltage regulators on the DIMM modules

AMD DDR5 memory support by 2021/2022, with Zen 4

Sources

www.techpowerup.com/269892/jedec-publishes-new-ddr5-standard-for-advancing-next-generation-high-performance-computing-systems

www.techpowerup.com/269623/micron-drives-ddr5-adoption-with-technology-enablement-program

www.techpowerup.com/266316/amd-to-support-ddr5-lpddr5-and-pci-express-gen-5-0-by-2022-intel-first-to-market-with-ddr5

www.techpowerup.com/265356/sk-hynix-unveils-ddr5-memory-details-production-to-start-this-year

www.techpowerup.com/265238/ddr5-arrives-at-4800-mt-s-speeds-first-socs-this-year

www.techpowerup.com/264193/samsung-begins-mass-production-of-industrys-first-16gb-lpddr5-dram

www.techpowerup.com/263555/micron-ships-worlds-first-lpddr5-dram-for-high-performance-smartphones

www.techpowerup.com/262772/a-walk-through-sk-hynix-at-ces-2020-4d-nand-ssds-and-ddr5-rdimms

www.techpowerup.com/249597/sk-hynix-announces-1ynm-16gb-ddr5-dram

www.techpowerup.com/243907/cadence-and-micron-demo-ddr5-4400-memory-module

www.techpowerup.com/239597/rambus-talks-hbm3-ddr5-in-investor-meeting

www.techpowerup.com/237233/rambus-has-ddr5-memory-working-in-its-labs-gears-for-2019-market-release

www.techpowerup.com/232060/jedec-says-ddr5-standard-development-rapidly-advancing-eta-2018

www.techpowerup.com/246045/samsung-announces-first-8gb-lpddr5-dram-using-10-nm-technology



HBM2E Graphics Memory [updated]

Release Date: 2020

Offers 3.2 Gbps per pin (33% faster than HBM2)

Samsung Flashbolt: 16 Gb per die, 8-layers stacked, 16 GB per chip with 410 GB/s bandwidth

Hynix: 460 GB/s, 3.6 Gbps, eight 16 Gb chips are stacked for a single 16 GB chip

Hynix: mass production has started as of July 2020

Sources

www.techpowerup.com/269317/sk-hynix-starts-mass-production-of-hbm2e-high-speed-dram

www.techpowerup.com/258194/sk-hynix-announces-its-hbm2e-memory-products-460-gb-s-and-16gb-per-stack

www.techpowerup.com/253876/samsung-electronics-introduces-new-flashbolt-hbm2e-high-bandwidth-memory



HBM3 Graphics Memory

Release Date: Not before 2019

Double the memory bandwidth per stack (4000 Gbps expected)

Expected to be produced using 7 nm technologies

Sources

www.techpowerup.com/239597/rambus-talks-hbm3-ddr5-in-investor-meeting



GDDR6X Graphics Memory

Release Date: 2020

Will first be used on new GeForce RTX 3000 / Ampere Series

Sources

www.techpowerup.com/268278/nvidias-next-gen-reference-cooler-costs-usd-150-by-itself-to-feature-in-three-skus



Silicon Fabrication Tech

TSMC 7 nanometer+

Release Date: Q4 2019

TSMC N7+ is successor to original 7 nm node

Uses EUV (Extreme Ultra Violet)

15-20% more density and improved power consumption over N7

Sources

www.techpowerup.com/259890/tsmc-starts-shipping-its-7nm-node-based-on-euv-technology



TSMC 6 nanometer

Release Date: Unknown

Backwards compatible with 7 nm process—no new design tools needed

Uses EUV (Extreme Ultra Violet), up to four EUV layers

18% higher logic density than N7

Sources

www.techpowerup.com/259890/tsmc-starts-shipping-its-7nm-node-based-on-euv-technology

www.techpowerup.com/255097/tsmc-expects-most-7nm-customers-to-move-to-6nm-density



TSMC 5 nanometer

Release Date: March 2020 to tape-out customer designs

Risk production as of Q2 2019

High volume production: Q2 2020

Uses TSMC's second implementation of EUV (Extreme Ultra Violet)

Up to 1.8x the density of 7 nm

Up to 14 layers

+15% higher clocks

Intel might be a customer of this node

N5P "Plus" node: improvement to N5 while staying on 5 nm, 84-87% increase in transistor densities over N7

Sources

www.techpowerup.com/264994/tsmc-n5p-5nm-node-offers-84-87-transistor-density-gain-over-current-7nm-node

www.techpowerup.com/260575/tsmc-5-nm-on-track-for-q2-2020-hvm-ramping-faster-than-7-nm

www.techpowerup.com/266969/tsmc-5-nm-customers-listed-intel-rumored-to-be-one-of-them

www.techpowerup.com/259536/tsmc-to-begin-mass-production-of-5nm-chips-in-2020

www.techpowerup.com/254380/tsmc-completes-5-nm-design-infrastructure-paving-the-way-for-silicon-advancement



TSMC 5 nanometer+

Release Date: 2021

High-volume production in Q4 2020

Uses EUV (Extreme Ultra Violet)

Sources

www.techpowerup.com/267793/tsmc-5-nm-node-manufacturing-goes-high-volume-in-q4-amd-one-of-the-major-customers



TSMC 4 nanometer [added]

Mass production: 2023

Codename "N4"

Uses EUV lithography

Sources

www.techpowerup.com/268282/tsmc-planning-a-4nm-node-that-goes-live-in-2023



TSMC 3 nanometer

April 2020: On-Track

Risk production: 2021

Volume production: H1 2022

FinFET technology

Uses TSMC's third implementation of EUV (Extreme Ultra Violet)

10-15% speed improvement at iso-power or 25-30% power reduction at iso-speed, compared to N5.

Sources

www.techpowerup.com/265991/tsmc-3nm-process-packs-250-million-transistors-per-square-millimeter

www.techpowerup.com/261853/tsmc-on-track-to-deliver-3-nm-in-2022

www.techpowerup.com/260464/tsmc-begins-3-nm-fab-construction



TSMC 2 nanometer

No details known other than "TSMC has started development"

June 2020: TSMC is accelerating R&D

Sources

www.techpowerup.com/268220/tsmc-accelerates-2-nm-semiconductor-node-r-d

www.techpowerup.com/266231/digitimes-tsmc-kicking-off-development-of-2nm-process-node



Samsung 6 nanometer

Release Date: Unknown

First product taped out as of Q2 2019

Uses EUV (Extreme Ultra Violet)

Special variant for customers

Sources

www.techpowerup.com/254648/samsung-successfully-completes-5nm-euv-development



Samsung 5 nanometer [updated]

Release Date: 2020

Ready for customer sample production as of Q2 2019

Mass production in Q2 2020

Yields are challenging as of Q2 2020

Uses EUV (Extreme Ultra Violet)

Up to 25% the density of 7 nm

20% lower power consumption

10% higher performance

Sources

www.techpowerup.com/270097/samsungs-5-nm-euv-node-struggles-with-yields

www.techpowerup.com/266368/samsung-to-commence-5nm-euv-mass-production-in-q2-2020-develop-3nm-gaafet-node

www.techpowerup.com/254648/samsung-successfully-completes-5nm-euv-development



Samsung 3 nanometer

Release Date: 2022

50% less power while delivering 30% more performance

45% less silicon space taken per transistor (vs 7 nm)

Sources

www.techpowerup.com/266368/samsung-to-commence-5nm-euv-mass-production-in-q2-2020-develop-3nm-gaafet-node

www.techpowerup.com/265751/samsung-to-deliver-3-nm-manufacturing-process-in-2022-with-next-generation-transistors



Intel 7 nanometer [updated]

Release Date: 2022 or 2023

Succeeded by 7 nm+ node in 2022, and 7 nm++ in 2023

Uses EUV (Extreme Ultra Violet)

4x reduction in design rules

Planned to be used on multiple products: CPU, GPU, AI, FPGA, 5G networking

Sources

www.techpowerup.com/270251/intel-7nm-cpus-delayed-by-a-year-alder-lake-in-2h-2021-other-commentary-from-intel-management

www.techpowerup.com/255338/intel-switches-gears-to-7nm-post-10nm-first-node-live-in-2021



Other

Hynix 4D NAND

Release Date: H1 2019

Developed by SK Hynix

Sampling in Q4 2018

Products demonstrated at CES 2020: Platinum P31 M.2 NVMe and Gold P31—PCIe 3.0 x4, using flash, DRAM and controller made by Hynix, over 3 GB/s read/write.

Reduces chip physical size, while increasing capacity at the same time

Supports TLC and QLC

30% higher write and 25% higher read performance

1.2 V

1st generation: 96 stacks, 1.2 Gbps per pin, 512 Gbit TLC

128 stacks in development, scales up to 512 stacks

Sources

www.techpowerup.com/249235/sk-hynix-launches-worlds-first-ctf-based-4d-nand-flash-96-layer-512gb-tlc

www.techpowerup.com/246633/sk-hynix-unveils-4d-nand-flash-memory-concept



Toshiba 5-Bit-per-Cell NAND Flash (PLC)

Release Date: Unknown

Stores an additional bit of information per cell (compared to QLC)

32 states per cell

Will enable even cheaper SSDs, probably with a performance cost

Sources

www.techpowerup.com/258650/toshiba-talks-about-5-bit-per-cell-plc-flash-memory



Toshiba XL-Flash

Developed by Toshiba

Uses existing SLC flash technology to improve latencies

1/10th the read latency of TLC

Good for random IOPS and better QoS at shallow queue depth

Can combine SLC and TLC/QLC for tiered, cost-optimized storage

Intel Optane memory competitor

128 gigabit (Gb) die (in a 2-die, 4-die, 8-die package)

4 KB page size for more efficient operating system reads and writes

16-plane architecture for more efficient parallelism

Fast page read and program times

Sources

www.techpowerup.com/257904/toshiba-memory-introduces-xl-flash-storage-class-memory-solution

www.techpowerup.com/246611/toshiba-looks-to-take-on-optane-with-xl-flash-low-latency-3d-nand-technology



Micron 128-layer 3D NAND Flash

Release Date: 2020, taped out as of Q4 2019

CMOS-under-array design, but with Replacement Gate (RG) Technology instead of Floating Gate

Only for few applications, more focused on next-generation RG tech, which brings down cost, too

Sources

www.techpowerup.com/259941/micron-tapes-out-128-layer-3d-nand-flash-memory



Toshiba 128-layer 3D NAND Flash

Release Date: 2020 or 2021

Developed by Toshiba and partner Western Digital

Called BiCS 5

According to a press release in Feb 2020, this is actually a 112 layer stacking process

Cells are TLC (not QLC)

Chip density: 512 Gb

Write performance per channel doubled to 133 MB/s

Sources

www.techpowerup.com/263457/kioxia-corporation-unveils-5th-generation-bics-flash

www.techpowerup.com/253373/toshiba-and-western-digital-readying-128-layer-3d-nand-flash



Intel 144-layer 3D NAND Flash [added]

Release Date: 2020

Supports QLC, but can be configured to work as TLC or SLC

SSD codename "Keystone Harbor"

PLC (5-bit per cell) technology development is underway

Optane product codename "Alder Stream", PCIe Gen4

Sources

www.techpowerup.com/266805/intel-ready-with-144-layer-3d-nand-on-its-own-talks-4-layer-3dxp-alder-stream-and-keystone-harbor



SK Hynix 128-layer 3D NAND Flash

Mass Production: July 2020

Up to 1 Tb TLC flash per chip

Data rate up to 1400 Mbps at 1.2 V

Products will be 2 TB client SSD with in-house controller and 16 TB / 32 TB NVMe datacenter SSDs.

Sources

www.techpowerup.com/266152/sk-hynix-to-commence-mass-production-of-128-layer-nand-flash-in-q2

www.techpowerup.com/257744/sk-hynix-starts-mass-producing-worlds-first-128-layer-4d-nand



Samsung 160-layer 3D NAND Flash

Release Date: End of 2020

7th generation V-NAND

Sources

www.techpowerup.com/266008/samsung-developing-160-layer-3d-nand-flash-memory



Intel CXL Interconnect

New interconnect for high-bandwidth devices like GPUs

Targeted at enterprise and servers

Competitor to NVLink, Infinity Fabric and PCI-Express

Uses PCIe physical layer

Link layer designed for low latency

32 Gbps per lane, per direction (Like PCIe Gen 5.0)

Sources

www.techpowerup.com/254462/intel-reveals-the-what-and-why-of-cxl-interconnect-its-answer-to-nvlink

www.techpowerup.com/253534/intel-releases-compute-express-link-cxl-1-0-new-interconnect-protocol-that-enables-pcie-gen-5-0



PCI-Express 5.0

Specification released end of May 2019

Products not expected before 2020

32 GT/s bandwidth per lane, per direction (4x the bandwidth of PCIe 3.0)

128/130 bit encoding (= 1.5% overhead)

Implements electrical changes to improve signal integrity and mechanical performance of connectors

Physical connector is backward compatible

Signalling is backward compatible with all previous PCIe versions

Sources

www.techpowerup.com/256084/pci-sig-achieves-32-gt-s-with-new-pci-express-5-0-specification

www.techpowerup.com/236591/pci-sig-pcie-4-0-in-2017-pcie-5-0-in-2019



PCI-Express 6.0

Specification targeted for 2021

Spec version 0.5 published as of Feb 24 2020

64 GT/s raw bit rate, up to 256 GB/s with x16

Includes low-latency Forward Error Correction (FEC) with additional mechanisms to improve bandwidth efficiency

Maintains backwards compatibility with all previous generations of PCIe technology

New physical layer with PAM4 (pulse amplitude modulation) signaling replacing NRZ (non-return to zero)

Sources

www.techpowerup.com/264172/pci-express-gen-6-reaches-development-milestone-on-track-for-2021-rollout

www.techpowerup.com/260177/pci-express-gen-6-0-specification-to-finalize-by-2021

www.techpowerup.com/256634/pci-sig-announces-pcie-6-0-specification



USB 4.0

Release Date: End of 2020

Specification Released: September 2019

Conceptually similar to Thunderbolt 3

Up to 40 Gbps speeds using two-lane operation

Multiple data and display protocols can share bandwidth

Uses USB Type-C connector

Backwards compatible with USB 2.0, 3.0, 3.1, 3.2 and Thunderbolt 3

Resulting connection scales to the best mutual capability of the devices being connected

Sources

www.techpowerup.com/258881/usb-if-announces-publication-of-usb4-specification

www.techpowerup.com/256526/speeding-up-your-usb-usb-4-0-products-expected-to-appear-by-the-end-of-2020



In this article, which our team will regularly update, we will maintain a growing list of information pertaining to upcoming hardware releases based on leaks and official announcements as we spot them. There will obviously be a ton of rumors on unreleased hardware, and it is our goal to—based on our years of industry experience—exclude the crazy ones. In addition to these upcoming hardware release news, we will regularly adjust the structure of this article to better organize information. Each time an important change is made to this article, it will re-appear on our front page with a "new" banner, and the additions will be documented in the forum comments thread. This article will not leak information we signed an NDA for.Feel free to share your opinions and tips in the forum comments thread and subscribe to the same thread for updates.