On January 6, AMD CEO Lisa Su took the stage at CES 2020 and announced four new products. The broadest range of products was the 7 nm Ryzen Mobile 4000 series, which comprises seven CPUs. Five of these CPUs are U-series for ultrathin laptops and have lower TDP (thermal design power) of 15 watts. The remaining two are H-series for high-performance laptops and have higher TDP of 45 watts.

With the Ryzen Mobile 4000, AMD mobile CPUs underwent a generational shift from 12 nm Zen+ to 7 nm Zen 2 architecture. The new CPUs have put AMD ahead of Intel, which is still stuck on its 10 nm Ice Lake mobile CPU. A smaller process node improves a CPU’s performance and reduces its power draw. AMD’s Zen 2 architecture delivered a 15% IPC (instructions per clock) boost over its predecessor, Zen.