Published Date: Mar 2020 | Report ID: GMI424 | Authors: Preeti Wadhwani, Shubhangi Yadav



Report Format: PDF | Pages: 280 | Base Year: 2019

Industry Trends

Molded Interconnect Devices (MID) Market size exceeded USD 500 million in 2019 and is estimated to grow at over 12% CAGR between 2020 and 2026. The market growth is attributed to increasing uptake of a 3D electromechanical function of MIDs in several industries to reduce the production cost, circuit density, and facilitate the militarization of the product.



MID offers high reliability and low failure ratio that attribute to the requirement for lesser auxiliary components, reducing the degree of complexities in systems. These features will contribute to the increasing demand in automotive, military, consumer electronics, and telecommunication applications.



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The rising demand to integrate more electronic products in smaller space is anticipated to increase market opportunities for MIDs in the consumer electronics industry. In mobile phones, these molded devices will reduce volume and achieve efficient space utilization by replacing normal antenna stub by an internal antenna. Therefore, the rising demand for mobile phones, laptops, and tablets will create significant opportunities for the molded interconnect devices market in coming years. The manufacturers of these portable electronics are focusing on implementing multiple functions in small packages, driving market opportunities.



Moreover, these devices add an advantage to enhance the aesthetic value of the mobile phones through its flexible feature. For example, plating and molding characteristics of MIDs can be used to modify the product variation, offering several colors and shapes. The increasing demand for smartphones with growth in internet connectivity will further boost the market share.



According to CTIA, the number of U.S. wireless devices reached 421.7 million with the addition of 21.5 million devices in 2018. Out of these wireless devices, 284.7 million devices were smartphones, i.e.,87% of the population in the U.S owns a smartphone.



Molded Interconnect Devices (MID) Market Report Coverage Report Coverage Details Base Year: 2019 Market Size in 2019: USD 500 Million Historical Data for: 2015 to 2019 Forecast Period: 2020 to 2026 Forecast Period 2020 to 2026 CAGR: 12% 2026 Value Projection: USD 1 Billion Pages: 280 Tables, Charts & Figures: 353 Geographies covered (21): U.S., Canada, UK, Germany, Spain, France, Italy, Sweden, Russia, China, India, Japan, Taiwan, South Korea, Taiwan, Malaysia, Australia, Brazil, Mexico, Saudi Arabia, UAE, South Africa Segments covered: Process, Application, and Region Companies covered (16): Amphenol T&M Antennas, Galtronics, Harting Mitronics AG, LPKF Laser & Electronics AG, MacDermid Enthone, Molex, Multiple Dimensions AG, RTP Company, S2P smart plastic product, SelectConnect Technologies, Suzhou Cicor Technology Co. Ltd, TE Connectivity, Teprosa GmbH, Tongda Group, Yomura, Material Suppliers: BASF, DSM, EMS-GRIVORY, Ensinger GmbH, Division Ensinger Compounds, Evonik Industries, Lanxess, Mitsubishi Engineering Plastics, PTS Group, RTP, Sinoplast New Material Ltd., Zeon Corporation Growth Drivers: Proliferation of wearable devices in the U.S.

Favorable regulatory scenario for electronic waste reduction in the European Union

High demand from automotive industry across Germany France Italy

Surge in demand for smartphones in Asia Pacific

Growth of semiconductor manufacturing industry in China South Korea Taiwan Pitfalls & Challenges: Raw material price issues

High tooling cost

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Growing uptake of laser direct structuring in healthcare is creating new market opportunities

The two-shot molding segment dominates the market with over 55% share in 2019. The growth is attributed to its ability to increase the efficiency and aesthetics of the rubber & plastic molding products. Also, the process requires only one machine cycle, which will reduce production cost and deliver more products per run. The process ensures a strong bond between materials and is therefore widely adopted in medical devices and automotive interior parts, among others.



The increasing demand for designing in medical-grade parts, equipment, and tools will increase the requirement for two-shot molding process, thereby adding an advantage for the molded interconnect devices market growth. The process can handle requirements including complex designs and medical cleanliness in healthcare applications.



Companies are implementing innovation & development strategies in the molding processes to gain a competitive edge over other players. For example, in January 2019, GW Plastics announced to increase its multi-shot molding capabilities to increase the level of automation and to cater to opportunities among healthcare OEMs.



Rising demand for automotive electronics will propel molded interconnect devices (MID) market growth

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The automotive applications held a market share of 16% in 2019 and will register around 16% gains through 2026. The growth is due to rising adoption of molded interconnect devices in a wide range of automotive applications including brake sensors, steering wheel hubs, lighting, and position sensors.



These devices are used in automotive applications to reduce the number of wirings and incorporate the required circuitry including housings and connectors in a single piece. Through these features, molded interconnect devices will gain a high market demand among manufacturers in the automotive sector to build compact devices at lesser costs.



The rising consumer demand to add more electronic features in vehicles will add an opportunity for the market. Major players in the automotive sector are introducing several new safety & entertainment features to deliver comfort and cater to the high market demand.



According to the OICA (International Organisation of Motor Vehicle Manufacturers), in 2018, the automotive production in Brazil, Portugal, Russia, and India recorded an increase of 5.2%, 67.7%, 13.9%, and 8.0% from the previous year.



Consumer electronics industry fueling the growth of the Asia Pacific market

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The Asia Pacific molded interconnect devices market will witness a growth of over 13.5% during the forecast timeline. This is owing to growing consumer electronics sector in China and India on account of availability of cheap labor and an easy supply of raw materials. This has prompted several market leaders in consumer electronics to enhance their footprint in the region.



Technology companies are focused on offering portable electronic products that are more reliable & compact, creating huge market opportunities for players in the market. Adding to this, several government initiatives to expand the manufacturing sector will add an advantage to the industry.



Focus on new technological innovation to stay competitive in the market

Prominent market players include MacDermid Enthone, LPKF Laser & Electronics, SelectConnect Technologies, Molex, Harting Mitronics AG, LPKF Laser & Electronics, and RTP company.



These players are majorly focused on research & development strategies to expand MID applications, in turn, expanding their market opportunities in various industries. For example, HARTING Technology Group is involved in the development of 3D MID, offering design freedom, functional integration, and a short process chain for customers in automotive, medical technology, and automation industries.



The market research report on molded interconnect devices includes in-depth coverage of the industry with estimates & forecast in terms of revenue in USD from 2015 to 2026 for the following segments:



Market by Process

LDS (Laser Direct Structuring)

Two-shot molding

Others

Market by Application

Automotive

Consumer products

Healthcare

Industrial

Military & aerospace

Telecommunication & computing

Others

The above information has been provided for the following regions and countries :

North America U.S. Canada

Europe UK Germany France Spain Italy Russia Sweden

Asia Pacific China India Japan Taiwan South Korea Malaysia Australia

Latin America Brazil Mexico

Middle East & Africa Saudi Arabia UAE South Africa





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