HBM3 and GDDR6 have been detailed at Hot Chips 28

HBM3 and GDDR6 have been detailed at Hot Chips 28

| Source: videocardz Author: Mark Campbell

HBM3 and GDDR6 have been detailed at Hot Chips 28

HBM3 and GDDR6 have been detailed at Hot Chips 28, showcasing increased bandwidth, decreased power consumption and increased capacities.

According to Samsung's presentation GDDR6 is set to release in around 2018 and offer bandwidth of 15Gbps, which is much higher than the 10Gbps that is currently offered by GDDR5X. Combine this with decreased power consumption and GDDR6 looks like a very attractive offering.

Right now GDDR5X with speeds of 12Gbps is on the way, but it is likely that in time GDDR6 will replace both GDDR5 and GDDR5X.

While a lot of people think that HBM2 and other high bandwidth memory standards will replace GDDR memory we must remember that HBM has some tricky design considerations to overcome before they can be used on more affordable products.

Right now HBM is planned for several markets, HPC and server where large banks of high bandwidth memory is desirable, Networking and Graphics where the memories low latency and high bandwidth/capacities can be easily utilised and Client computing where HBM's space saving and power saving characteristics could greatly benefit system integrators.

HBM Gen 3 is expected to release in around 2019/2020 and offer bandwidth that is at least 2x higher than HBM2 and double the capacity per chip, all within a power envelope that is similar to HBM2.

This will make HBM3 very attractive for the HPC and server markets, as it will allow HBM to offer capacities which can rival that of large DDR4 memory banks today and at the same time offer power savings and increased bandwidth.

Right now HBM2 has not been used in a consumer product, though it is expected that we will see HBM2 power GPUs in early 2017.

Before HBM can completely replace GDDR memory products will need to be created that are designed with it in mind, meaning that a lot of companies will need to change the way they design their chips.

You can join the discussion on HBM3 and GDDR6 on the OC3D Forums.

HBM3 and GDDR6 have been detailed at Hot Chips 28, with increased bandwidth and capacity.https://t.co/7n7BJpZjVz pic.twitter.com/eDhnsz7NAk — OC3D (@OC3D) August 22, 2016

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