Qualcomm is holding its second Snapdragon technology summit from December 4 to 8 in the U.S state of Hawaii. There are rumours that the next-gen Snapdragon 845 processor will be announced during the summit. The news coming out of China is that Xiaomi’s CEO Lei Jun is in Hawaii to participate in the event. The tech Czar was spotted at an Airport in Hawaii thus fueling speculations that next year’s Mi 7 flagship will be the first Chinese model to have the SD 845 chip.

The Snapdragon 845 is expected to be manufactured using the 10nm FinFET process and would debut on the Samsung Galaxy S9 which may be launched at CES 2018. The LG G7 and Sony Xperia XZ2 are also expected to utilise the flagship chip. While on the domestic scene, Xiaomi is tipped to be the first OEM that would utilise the chip on the Mi 7. Recall that Xiaomi was the first to use the present Snapdragon 835 chip on its smartphone earlier this year. Xiaomi also has a long-standing relationship with Qualcomm. It is reported that right from the debut of the Snapdragon 800 series till date, Xiaomi accounts for 66% of Qualcomm’s China shipments.

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The Snapdragon 845 chip is said to utilise Samsung’s 10nm LPE process and the CPU is composed of four improved Cortex-A75 Kyro core and four Cortex-A53 small cores. The GPU is said o have been upgraded to Adreno 630 and the chip integrates the X20 baseband with support for five 20Hz carrier aggregation with a maximum download speed of 1.2Gbps.

(source)

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