Fingerprint Sensor

Biometric security is added to the display subsystem using the only Qualcomm part we have found in the Exynos Galaxy S10+ so far. This new, ultrasonic sensor uses sound waves generated using a piezo-electric component. The entire solution is provided by Qualcomm and includes their QBT2000 ASIC assembled to a flex substrate. There are a couple of advantages for using sound waves instead of an optical in-display fingerprint sensor like we first saw in the Vivo X21 UD

The first is the 3D Sonic solution, which allows for unlocking the phone even when there is debris or moisture on the finger, or if for some reason you need to unlock your phone while it is submerged in water. This is because the sensor is looking for density differences in the fingerprint instead of an optical image.

Two other points of note about the Qualcomm 3D sonic sensor: the first, which can be most important from a manufacturing standpoint, is the Qualcomm 3D Sonic solution does allow for assembly rework in the manufacturing line if there is an issue with the main display subsystem or with the sensor assembly itself. This means if the panel or the sensor assembly are not repairable, it is possible to save at least some of the assemblies. This can amount to cost savings in an event a defect occurs.

The second note, Qualcomm has several different sizes for the 3D Sonic Sensor. In the Galaxy S10+, the sensor is only 4mm x 9 mm, however, Qualcomm reports larger sensors are on their way, including a sensor with 24 cm2 large area.