In anticipation of forthcoming product announcements, Asetek today announced an ongoing collaboration with Intel to provide hot water liquid cooling for servers and datacenters.

Asetek liquid cooling solutions are designed to support high-powered CPUs in an energy-efficient and cost-effective manner,” said Andre Eriksen, Asetek CEO and Founder. We are excited about the work we’ve done with Intel to enable their customers and partners to realize the benefits that hot water liquid cooling can provide in datacenter environments.”

This collaboration, which includes Asetek’s ServerLSL and RackCDU D2C technologies, is focused on the liquid cooling of density-optimized Intel Compute Modules supporting high-performance Intel Xeon Scalable processors.

Our customers are looking to use high-performance Intel processors in very dense configurations,” said Al Diaz, VP and general manager, Product Collaboration and Systems Division, Intel Data Center Group. “The work we’ve done with Asetek will enable them to support highly demanding datacenter workloads in a liquid cooled environment.”

In this video from SC17 in Denver, Steve Branton from Asetek describes the company’s wide array of liquid cooling solutions for HPC.

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