FLIR are making some really great miniature thermal cameras these days, designed for applications such as self-driving cars, and tools that help keep firefighters safe. That’s great and all, but these thermal cameras are so cool, you really just want to play with one. That’s what [greg] was thinking when he designed a PCB backpack that captures thermal images from a FLIR Boson and stores it on an SD card. It’s a thermal action cam, and an impressive bit of FPGA development, too.

The FLIR product in question is a Boson 640, an impressive little camera that records in 640×512 resolution, with a 60 Hz update rate. This one’s got the 95° field of view, giving it a very good specification in a very small footprint. This is a huge improvement over FLIR’s Tau camera, for which [greg] built a breakout board with Ethernet and DDR memory a few years ago. Once he found out about the Boson, he figured a backpack PCB for this camera would be possible and a great excuse to teach himself FPGAs with a hands-on project.

With an impressive ability to find the perfect part, [greg] sourced a Lattice iCE40 FPGA in an 8×8 mm package along with an 8 Mbit HyperRAM in a 6×8 package. This combination allows for all the chips to fit behind the Boson camera. Add in an microSD card slot and a few connectors and this breakout board is very close to being a commercial product, for whatever forward looking infrared needs you might have.