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analyst today warns that (INTC) could experience some delay in its production of chips using the latest manufacturing technology, although production of existing parts appears to be doing a little better than Wall Street expects.

Mullane has been spending the week at the , or , conference on "advanced lithography" that's taking place in San Jose, California. He relates the chatter he's heard about Intel running into issues with its production of chips with the smallest feature sizes being 10 billionths of a meter:

10nm equipment installations remain on schedule at Fab 28 (Israel) in preparation for 2H production ramp; however, the process of record is still not finalized for this technology node. Our latest discussions at the SPIE Litho Conference this week still indicate that the 10nm process equipment installations remain on plan at Fab 28 (Israel). However, we are hearing that INTC is still struggling with defect/yield issues with this advanced process for High Volume Manufacturing (HVM) release and have not locked down the complete process of records (PORs) to date. While the production ramp target at Fab 28 is 2H17, there are concerns that this ramp could be delayed by 2-3 months.

