Damaged or missing BGA pads are another common issue at BGA sites that require ball grid array repair to be done. These pads are replaced following an IPC recommended procedure which uses specially fabricated adhesive-backed BGA pads that are bonded to the board surface. But before this ball grid array repair procedure can get started, the lifted solder pads need to be repaired. The reason? Repair of damaged solder mask between BGA pads and connecting vias is a critical step to prevent solder from flowing down the vias during the BGA pad replacement process. This step needs to be accomplished prior to placement of the replacement BGA as part of the (ball grid array) BGA rework process.

When you have a design that requires changes or modifications at a BGA site, using a standard jumper wire is not normally a viable option. Jumper wires are simply too large to fit under a BGA component. A repair or modification employs the use of flat copper ribbon that is thin enough to fit safely under the BGA component. This BGA repair will allow you to save your design and avoid the costly expense of doing another board build.

BEST provides industry-leading solutions for BGA and other grid array device reworks. Our engineers have developed better processes to make BGA repair and rework more repeatable, consistent and reliable. We have been reworking BGAs since their inception, and continue to stay on the cutting edge with the latest package styles and techniques.

When you partner with BEST, we leverage our extensive industry experience and commitment to quality and customer service to bring you several benefits you will not find elsewhere, including:

The most advanced re-work equipment available on the market today – we always have the best tool for any job.

IPC-Certified Technicians specially trained for BGA rework and x-ray verification assigned to EVERY job.

Full transparency with a disc of appropriate x-ray images returned to you after the job is complete. Your Full Service BGA Rework Partner

At BEST, we are your 'one-stop' solution, offering a wide range of ball grid array rework and repair services that include:

We can also help you diagnose and troubleshoot your own ball grid array rework process. Our knowledgeable SMT process engineers can review your process documentation, audit your BGA rework or ball grid array repair process or develop a highly successful one for your operation including the development of thermal profiles which are critical to reworking the location without knowing the specifics of how to run your ball grid array rework equipment.

BGA Rework video