NTT DOCOMO, INC., NEC Corporation, Panasonic Mobile Communications Co., Ltd. and Fujitsu Limited announced today that they have jointly developed the software and hardware intellectual property for a single large-scale integration (LSI) chip that will enable small, energy-efficient modems to support the GSM, W-CDMA, HSPA+ and LTE mobile standards. Performance evaluation of the LSI engineering sample chip was completed previously, and as of today, all testing required to confirm interconnectivity to the mobile networks of major vendors has also been completed. The development means that modems in future mobile devices will require just one chip, rather than two chips required in many conventional cases, in order to operate on multiple mobile standards. The single chip reduces power consumption by about 20% during both communication and stand-by, as well as decreases the production cost for mobile devices.