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BGA ASSEMBLY CAPABILITIES

1. Automatic placement of CBGA, PBGA, MBGA Verification of BGA's using real-time x-ray system.

2. Removing & Replacing BGA's & MBGA's, Experienced with Ceramic & Plastic BGA's, Reballing BGA's & MBGA.

SMT ASSEMBLY CAPABILITIES

1. Ball Grid Array (BGA)

2. Ultra-Fine Ball Grid Array (uBGA)

3. Quad Flat Pack No-Lead (QFN)

4. Quad Flat Package (QFP)

5. Plastic Leaded Chip Carrier (PLCC)

6. SOIC, Package-On-Package (PoP)

7. Small Chip Packages (Pitch of 0.2 mm)

THROUGH-HOLE ASSEMBLY

Automated Through-Hole Assembly

Manual Through-Hole Assembly

Through-hole mounting techniques are now usually reserved for bulkier or heavier components such as electrolytic capacitors or electromechanical relays that require great strength in support

MIXED ASSEMBLY ADVANTAGES

Mixed Assembly - Through-Hole, SMT and BGA components are housed on the PCB. Single- or double-sided mixed technology or SMT (Surface Mount) for PCB assembly. Single- or double-sided BGA and micro-BGA installation and rework with 100% X-ray inspection

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