With its 9th generation Core processors, Intel is re-introducing soldered IHS (integrated heatspreaders), at least in its top two premium models, the Core i9-9900K, and the Core i7-9700K. Intel refers to this feature as STIM (soldered thermal interface material). AMD implements soldered IHS across its Ryzen "Summit Ridge," "Pinnacle Ridge," and Threadripper families. XFastest took apart an i9-9900K to confirm that Intel is indeed using solder. Soldered IHS is generally preferred for better heat-transfer characteristics, compared to fluid TIMs. The use of fluid TIMs prompts some serious enthusiasts to even "de-lid" (run their processors without the IHS).The 8-core "Whiskey Lake-S" die could be around 178 mm² in area, with the addition of two more cores, and 4.5 MB more cache (L2 + L3), over its predecessor. You'll recall that the 6-core "Coffee Lake" die measures 150 mm², a 25 mm² gain over the 4-core "Kaby Lake" die. We aren't expecting Intel to change the iGPU or uncore components. Intel is building these dies on the same 14 nm++ silicon fabrication node as "Coffee Lake," with the only architectural difference being silicon-level hardening against certain security vulnerabilities.